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NEWS TAGGED PACKAGING AND TESTING
Wednesday 13 October 2021
Tian Zheng enters into semiconductor applications, expects equipment shipments to double in 2022
Tian Zheng International Precision Machinery (TZI), which has a high market share in sorting, packaging and testing equipment for passive components, has seen strong order momentum...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...
Thursday 7 October 2021
Tongfu to raise CNY5.5 billion for capacity expansions
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
Friday 1 October 2021
DDI packaging and testing to continue to grow in 2022: Q&A with Chipbond CEO Wu Fei-Jain
Since the outbreak of the COVID-19 epidemic, the global electronics supply chain has been bogged down by the effects of the "broken chain," uneven component supply, and frequent price...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Friday 13 August 2021
IC shortage to remain challenging in 2022, says ASE
A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.
Tuesday 3 August 2021
OSATs in talks with substrate suppliers about 2023 orders
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Friday 30 July 2021
IC backend sector to see new supply-demand balance in 2023, says ASE Technology
ASE Technology expects the IC backend sector not to reach a new balance between supply and demand until 2023 at the earliest, and it has landed some long-term orders set for fulfillment...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...