Toshiba Memory has announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely-used serial peripheral interface (SPI),...

While China DRAM startup ChangXin Memory Technologies (CXMT) is set to kick off commercial production of DRAM chips soon, its cooperative partner GigaDevice Semiconductor Beijing...

China-based GigaDevice Semiconductor has unveiled what the company claims is the world's first 32-bit general-purpose MCU based on RISC-V architecture, with the product samples and...

Despite lackluster memory demand likely to persist till the end of 2019, the memory industry is expected to see a brighter prospect starting 2020 when 5G services kick off commercial...

Specialty DRAM and flash memory maker Winbond Electronics has seen its 12-inch fab run at full capacity starting July, thanks to the arrival of new orders and seasonal factors.

Winbond Electronics, a maker of specialty DRAM and flash memory, and mask ROM and flash memory specialist Macronix International both saw their second-quarter revenues register double-digit...

Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed...

NOR flash memory prices, which experienced a double-digit sequential drop in the first quarter of 2019, will continue to fall but at a slower pace in the second and third quarters,...

With Nintendo's Switch reportedly to become available in China, Macronix International is expected to see its ROM chip shipments pick up later in 2019, according to industry source...

Winbond Electronics and Macronix International have reported sequential increases in March consolidated revenues of nearly 14% and 8.8%, respectively.

Memory market demand is expected to pick up in the second half of 2019, according to Miin Wu, chairman for flash memory and mask ROM chipmaker Macronix International.

Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging...

Global NOR flash production value fell 7% sequentially and 14% on year in the fourth quarter of 2018, due to price falls for mid- and low-density chips and impact of lingering US-China...

Micron Technology has announced its automotive-grade LPDDR4X memory devices are being adopted for Qualcomm's third-generation Snapdragon automotive cockpit compute systems. The companies...

Winbond Electronics and Macronix International have reported sequential decreases in November consolidated revenues of 3.2% and 21.8%, respectively.