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NEWS TAGGED MONTEVINA
Thursday 12 November 2009
Intel to launch three Arrandale CPUs for ultra-thin notebooks in 1H10
Intel plans to launch three 32nm dual-core Arrandale CPUs (Calpella platform), the Core i7-640UM (1.2GHz), Core i7-620UM (1.06GHz) and Core i5-520UM (1.06GHz) with price in thousand-unit...
Tuesday 12 May 2009
Intel outlines notebook plans for 2H09
Intel recently outlined its plans for traditional notebook, CULV-based ultra-thin notebook and netbook product lines for its partners, according to sources at notebook makers.
Tuesday 21 April 2009
Intel to launch only three Clarksfield processors in 2009
Intel will debut its new notebook platform (Calpella) in the third quarter of 2009, but will launch only three new processors (Clarksfield) to accompany the new platform this year,...
Wednesday 25 February 2009
Intel to launch new CPUs for ultra-thin notebooks
Intel plans to launch two new ultra low voltage (ULV) CPUs by the end of March this year mainly targeting the company's consumer ultra low voltage (CULV) platform for ultra-thin notebook...
Thursday 23 October 2008
Intel planning Montevina Refresh notebook platform for April next year
Intel is planning to introduce the Montevina Refresh for notebooks in April, according to sources at notebook makers.
Thursday 31 July 2008
Taiwan market: Sony launches new Vaio series notebooks
Sony has launched high-end Vaio Z-series, enterprise and entertainment Vaio SR-series and high-definition multimedia entertainment Vaio FW-series notebooks in Taiwan, all adopting...
Friday 18 July 2008
Notebook platform transition to be faster this year
Intel's delay of its Centrino 2 (Montevina) platform has given notebook vendors extra time to clear inventory, and since most vendors were cautious over supply in the second quarter,...
Tuesday 8 July 2008
The launch of Centrino 2 to boost Taiwan supply chain, says paper
Intel recently issued a notice that its Centrino 2 notebook platform (Montevina) will launch on July 15 in Taiwan. Industry players that form the platform's supply chain in Taiwan...
Friday 27 June 2008
Toshiba aims to grab back 15% worldwide notebook market share in 2010
Toshiba has set a goal to achieve a worldwide notebook market share of 15% in 2010. The company will focus on targeting emerging markets including China, Vietnam and Thailand, which...
Wednesday 18 June 2008
Anadem, not just a vendor but a full-service company
Anadem, a Taiwan-based whitebox notebook vendor has been in notebook market for over 15 years. Though not as famous as the worldwide Top-10 notebook vendors, the company still has...
Tuesday 17 June 2008
Delayed launch of Intel Montevina platform to not affect shipments of 802.11n built-in modules
The delayed launch of Intel's Centrino 2 (Montevina) notebook platform will have limited impact on shipments of built-in 802.11n modules from Taiwan network-equipment makers, according...
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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