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Friday 24 September 2021
Qualcomm dominates cellular baseband market in 2Q21, says Strategy Analytics
The global cellular baseband processor market grew 16% on year to US$7.2 billion in the second quarter of 2021, according to Strategy Analytics. Qualcomm capitalized on iPhone 12...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Friday 6 November 2020
GF, Soitec announce RF-SOI wafer supply agreement
Globalfoundries and Soitec have announced a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers.
Friday 14 August 2020
Qualcomm-equipped 5G smartphones fastest, says Strategy Analytics
Tests of 5G smartphone downlink speed in the US and UK by Ookla show that smartphones using the 5G millimeter wave bands, on average, achieve blazingly fast downlink speeds 20 times...
Tuesday 16 June 2020
Winbond introduces a new unique and innovative product QspiNAND Flash for use with the Qualcomm 9205 LTE Modem
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a new version of QspiNAND Flash designed for use with the Qualcomm 9205...
Friday 7 February 2020
DSS to be used for enterprise applications for 5G in 2H20, says Digitimes Research
To improve 5G spectrum's usage efficiency, 3GPP has brought up several solutions with dynamic spectrum sharing (DSS) being one of the major technologies expected to be used when transitioning...
Monday 20 January 2020
PC market still full of opportunities: Q&A with Frank Soqui, VP of Client Computing Group and GM of Gaming Division at Intel
Intel currently still holds an 80% share in the global PC market, but the growth of the CPU giant's PC platform business has weakened, thanks to prolonged shortages of its processors...
Friday 20 December 2019
MLCC market poised for recovery in 2020
Taiwan- and China-based MLCC suppliers have stepped up their pace of equipment orders for additional production capacities recently, an indicator suggesting the market for MLCCs may...
Friday 23 August 2019
Worldwide 5G network infrastructure revenues to reach US$4.2 billion in 2020, says Gartner
In 2020, worldwide 5G wireless network infrastructure revenues will reach US$4.2 billion, an 89% increase from 2019's US$2.2 billion, according to Gartner.
Friday 16 August 2019
Orders for upcoming iPhones conservative, say PCB firms
Orders for the iPhones slated for launch in September have thus far been weaker compared to the momentum in previous years, according to sources at PCB makers.
Wednesday 31 July 2019
Samsung sees double-digit tablet PC sales increase in Taiwan
Samsung Electronics and Apple have seen impressive tablet sales in Taiwan, with the former's surging 24% on year in volume and 16% in value so far this year, according to industry...
Monday 8 July 2019
Taiwan Star Telecom prepares for 5G migration with Nokia end-to-end portfolio
Nokia has announced that TST (Taiwan Star Telecom) has chosen the equipment vendor's end-to-end (E2E) solution to expand the coverage and capacity of its LTE network to support subscriber...
Wednesday 26 June 2019
ZTE launches 5G/FTTH dual-mode home gateway
ZTE has launched a 5G/FTTH dual-mode home gateway at Mobile World Congress Shanghai 2019. It is compatible with the 5G networks of high bandwidth, low latency and massive connections,...
Tuesday 28 May 2019
Qualcomm, Lenovo unveil Snapdragon-powered 5G PC
Qualcomm and Lenovo have jointly introduced a Snapdragon-powered 5G PC - Project Limitless - which the companies claim is the world's first 7nm platform purpose-built for PCs that...
Thursday 10 January 2019
Taiwan networking specialists highlight 5G, IoT applications at CES 2019
As part of their efforts to embrace the 5G era, many Taiwan network equipment makers including Sercomm, Zyxel Communications and Wistron NeWeb (WNC) are showcasing the latest 5G and...
Tuesday 30 April 2019
iPad Air with Apple Pencil support
The new iPad Air in an ultra-thin 10.5-inch design offers the Apple Pencil support. With the A12 Bionic chip with Apple's Neural Engine, the new iPad Air delivers a 70% boost in performance and twice the graphics capability, and the advanced Retina display with True Tone technology is nearly 20% larger with over half a million more pixels, according to the vendor. The Apple-designed Neural Engine of the A12 Bionic chip powers the next generation of apps and iPad workflows using advanced machine learning and Core ML for engaging AR experiences, photo-realistic effects in 3D games and graphics performance within apps. The new iPad Air features the same Wi-Fi performance and Gigabit?class LTE connectivity built into the iPad Pro models. With eSIM technology built in, users can connect to wireless data plans right from iPad when traveling in more than 180 countries around the world, according to Apple.
Tuesday 18 October 2016
Samsung 14nm chips for wearables
Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.
Wednesday 31 August 2016
Samsung 14nm Exynos chips
Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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