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NEWS TAGGED LEADFRAME
Wednesday 23 June 2021
Taiwan leadframe makers land new orders from China
Taiwan-based lead frame makers including SDI and Jih Lin Technology have obtained new orders for intelligent power modules from China, according to industry sources.
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Tuesday 30 March 2021
Leadframe supplier CWTC sees clear order visibility through April 2022
Leadframe supplier Chang Wah Technology (CWTC) has seen clear order visibility through April 2022, in line with wire-bonding process capacity at backend houses already booked by chipmakers...
Thursday 18 March 2021
I-Chiun to hike leadframe prices
I-Chun Precision Industry will soon hike quotes for leadframes used in LED and IC packaging to reflect increases in costs for copper and other metals, with the adjustment to vary...
Wednesday 24 February 2021
Leadframe makers about to raise prices
Taiwan-based leadframe makers are about to raise their prices to reflect rising copper material costs, according to industry sources.
Tuesday 23 February 2021
Foundry, packaging materials in tight supply
The supply of foundry and packaging materials, such as photoresist and leadframes, has already fallen short of demand, prompting related distributors to raise prices, according to...
Thursday 18 February 2021
Taiwan leadframe makers to post revenue growth through 3Q21
Taiwan-based leadframe makers including Shuen Der Industry (SDI) and Jih Lin Technology are poised to post sequential revenue increases through the third quarter of 2021, thanks to...
Tuesday 19 January 2021
Prices to rise 5-10% for automotive power module leadframes
Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...
Monday 18 January 2021
Automotive chips vendors mull adopting FOPLP backend technology
Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
Wednesday 23 December 2020
CWTC readies NT$10 billion for leadframe capacity expansions, acquisitions
Leadframe maker Chang Wah Technology (CWTC) has readied NT$10 billion (US$355.05 million) in new funds, including a 5-year syndicated loan of NT$7.2 billion (US$255.6 million) newly...
Monday 30 November 2020
Jih Lin eyes significant surge in leadframe shipments for auto power modules
With the global car market showing signs of recovery, power module leadframe maker Jih Lin Technology is confident about a 10-20% on-year revenue growth in 2021 with leadframes for...
Friday 27 November 2020
ASE, Greatek see QFN wire bonding run at full capacity for PMICs
IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...
Friday 27 November 2020
Taiwan leadframe makers join Tesla supply chain for EV chargers
Taiwan-based leadframe makers including Jih Lin Technology and SDI have reportedly cut into the supply chain for Tesla's charging piles, and are poised to embrace significant increases...
Monday 23 November 2020
Leadframe orders visibility till 2Q21 on strong auto, 5G applications
Taiwan's leadframe makers including Jih Lin Technology and SDI have seen clear order visibility through the second quarter of 2021 due to a significant recovery in demand for discrete...