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NEWS TAGGED LEADFRAME
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Wednesday 22 June 2022
Taiwan leadframe makers enjoy brisk orders for automotive power modules
Taiwan-based leadframe makers Jih Lin Technology and Shuen Der Industry (SDI) have seen clear order visibility through the end of 2023, buoyed by strong demand for automotive power...
Wednesday 15 June 2022
IC packaging materials demand remains strong
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Monday 9 May 2022
ASE sourcing more aQFN leadframes for Wi-Fi 6/6E/7 SoCs
ASE Technology has landed big orders from Qualcomm and MediaTek for processing their Wi-Fi-Fi SoCs with its unique aQFN (advanced quad flat no-lead) technology, and is actively seeking...
Tuesday 19 April 2022
OSATs say production remains normal in Suzhou amid semi-lockdown
Taiwan-based OSATs including ASE Technology have said their local manufacturing operations in Suzhou remain normal despite the city entering a COVID-induced semi-lockdown, but they...
Friday 15 April 2022
Jih Lin revenue ratio for automotive leadframes to exceed 50% by 2023
Taiwan-based leadframe maker Jih Lin Technology expects sales of its car-use offerings to grow steadily for a revenue contribution ratio of over 50% by 2023 thanks to strong demand...
Friday 8 April 2022
Leadframe makers, IDMs team up to serve major EV vendors
Taiwan's major leadframe makers including Jih Lin Technology and SDI are joining forces with international IDMs to supply customized power modules to Tesla and other first-tier EV...
Thursday 7 April 2022
IC packaging leadframe, substrate prices to rise in 2Q22
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
Tuesday 22 March 2022
Leadframe supplier CWTC sees order visibility extended to 2023
Leadframe supplier Chang Wah Technology (CWTC) has seen the visibility of orders from its IDM customers for automotive and industrial applications extended to 2023, according to the...
Tuesday 15 March 2022
Nickel price volatility prompts packaging materials suppliers to stop taking orders
Nickel prices have been volatile, discouraging IC packaging material suppliers, such as leadframe makers, from taking new orders, according to industry sources.
Thursday 24 February 2022
Taiwan chipmakers see their role in global EV supply chain grow
The role of Taiwan's IC industry is growing amid the persistent shortage of automotive chips.
Thursday 24 February 2022
Infineon WBG chip capacity expansion in Malaysia to benefit Taiwan leadframe makers
Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex...
Tuesday 8 February 2022
Infineon aims to ramp up in-house production in 2022
German-based automotive and power semiconductor supplier Infineon is planning to ramp up in-house production in 2022 as it expects semiconductor demand to continue to outweigh the...
Wednesday 19 January 2022
Leadframe suppliers gearing up for capacity expansion
Leadframe supply for IC packaging remains tight, and suppliers such as Chang Wah Technology (CWTC) have been keen to expand production capacity to satisfy strong demand for processing...
Friday 24 December 2021
Molding compounds to see worst crunch among packaging materials in 2022
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...