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NEWS TAGGED LCD DRIVER IC
Wednesday 11 April 2012
Chipbond, ChipMOS see sequential growth in March revenues
LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...
Friday 6 April 2012
Himax raises guidance for 1Q12
Himax Technologies has revised upward its sales, gross margin and EPS guidance for the first quarter of 2012, citing strong sales of its display driver ICs as well as growth in its...
Monday 19 March 2012
ChipMOS expects sales growth in 2012
Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...
Tuesday 13 March 2012
Chipbond sees flat growth in 1Q12 sales
Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...
Tuesday 13 March 2012
LCD driver IC demand picking up
The visibility of orders for small-size LCD panel driver ICs has extended through the end of the second quarter, thanks to a ramp-up in orders prior to new phone and tablet rollouts...
Friday 10 February 2012
Chipbond sales to rise 5% in 1Q12, says paper
LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...
Thursday 2 February 2012
Renesas to terminate large-size LCD driver IC business
Renesas Electronics has unveiled plans to withdraw from the large-size display driver IC business, citing the slowdown of the flat panel display market and falls in prices.
Wednesday 18 January 2012
Some Taiwan LCD driver IC designers release orders to South Korea-, Japan-based packaging/testing firms
Some Taiwan-based LCD driver IC design houses, in order to spread risks, have placed orders for 8-inch bumping packaging and testing services with South Korea- and Japan-based providers,...
Tuesday 3 January 2012
Chipbond, ChipMOS develop alternative to gold bumping
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Monday 2 January 2012
ChipMOS aims at 10-15% revenue growth in 2012
Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...
Tuesday 6 December 2011
Powerchip mass producing driver ICs at 90nm
Powerchip Technology has announced mass production of the foundry segment's 90nm high-voltage process technology for small- to medium-size driver ICs used in mobile device applications,...
Wednesday 23 November 2011
LCD driver IC design firms diversifying products
Taiwan-based LCD driver IC design houses have moved to diversify their product portfolios to mitigate the impact of stagnant panel demand, according to industry sources. Driver IC...
Wednesday 9 November 2011
Specialty IC foundry VIS reports revenue decline for October
Vanguard International Semiconductor (VIS) has reported an 8.3% sequential decrease in October revenues, citing lower shipments.
Thursday 3 November 2011
Chipbond launches share buyback program
LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...
Thursday 3 November 2011
Chipbond expects flat or slight growth in 4Q11 sales
Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...