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Saturday 27 September 2025
Samsung breaks silence on 12-layer HBM3E validation
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media...
Friday 26 September 2025
SK Hynix reportedly to begin 1c GDDR7 production in 2025, eyeing Tesla and Nvidia orders
SK Hynix is reportedly set to begin producing GDDR7 memory on its sixth-generation 1c DRAM node, a 10nm-class technology. Likely customers include long-standing partners Tesla and...
Friday 26 September 2025
Samsung reportedly cuts 2nm foundry prices by 30% to counter TSMC's 50% hike
The global race to build the future of technology just got dramatically more expensive. TSMC is reportedly planning a staggering 50% price increase for its next-generation 2nm chips...
Friday 26 September 2025
Micron rises to second in global HBM market as Samsung slips
Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter...
Thursday 25 September 2025
LG group quietly launches space ambitions, tied to national rocket program

In a surprise announcement, South Korea's LG Group declared its formal entry into the space industry, revealing that the conglomerate's...

Thursday 25 September 2025
Samsung pushes DRAM to record highs, SK Hynix scales up, CXMT struggles on DDR5
Samsung and SK Hynix are accelerating DRAM wafer production as demand rebounds and prices climb, while China's CXMT falls behind in the DDR5 transition, limiting its ability to compete...
Wednesday 24 September 2025
South Korea urges US visa fee discounts amid H-1B cost hike
South Korean scholars have urged government support to reduce the new US$100,000 H-1B visa fees, suggesting a stabilization fund, tax incentives for small and medium-sized enterprises...
Wednesday 24 September 2025
Huawei's custom HBM challenges the existing memory hegemony
China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The...
Wednesday 24 September 2025
Hyundai expands demand responsive transit services to address mobility gaps
Hyundai Motor Group is stepping up efforts to expand its mobility business, investing in demand-responsive transit (DRT) platforms as part of its strategy to diversify beyond traditional...
Tuesday 23 September 2025
Samsung reportedly struggles with HBM4 yields as SK Hynix leads memory race
Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia's trust to defend its lead...
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Tuesday 23 September 2025
Commentary: China’s display push challenges Taiwan’s panel makers
Over a decade ago, China's IT industry still heavily relied on imported chips and displays, but as of today, influenced by China-US geopolitical tensions, while the chips still depend...
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
Tuesday 23 September 2025
Shinsegae-Alibaba JV targets Coupang-Naver's South Korea e-commerce dominance
South Korea's Fair Trade Commission has approved the establishment of a joint venture between Shinsegae Group and China's Alibaba Group, a move that could potentially reshape the...
Tuesday 23 September 2025
Nvidia-Intel alliance deepens US-China tech divide
Nvidia said it will invest US$5 billion in Intel and broaden cooperation in semiconductor design and development. The deal does not include chip fabrication but is viewed as a key...