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Saturday 18 July 2026
LG bets on India as its biggest AC base, as its third plant runs ahead of schedule
LG Electronics is on course to bring its third Indian plant online earlier than planned, a step that would make India the company's single largest air-conditioner production base and...
Saturday 18 July 2026
Column: South Korea's semiconductor strategy faces foresight and structural gaps
South Korea's technology policies—including the two semiconductor strategies discussed previously and the broader K-Moonshot initiative introduced more recently—have been...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
TCL starts OLED monitor panel production ahead of Guangzhou fab opening
TCL CSOT has started producing a 27-inch inkjet-printed OLED monitor panel at its Gen 5.5 line in Wuhan, giving the Chinese display maker an early foothold in consumer OLED monitors...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
Friday 17 July 2026
SK Group chair floats 'memory as a service' model for SK Hynix

SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a...

Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake...

Thursday 16 July 2026
Samsung turns to titanium to reduce screen creases in next foldables
Samsung Electronics unveiled a new titanium-based display structure on July 15, designed to reduce screen crease visibility while improving durability and preserving a slim profile...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Thursday 16 July 2026
LG Electronics ramps up actuator hiring as AXIUM production starts early
LG Electronics is expanding hiring for its robotic actuator business after reportedly starting AXIUM production months ahead of schedule, as the South Korean company builds the development,...
Thursday 16 July 2026
Samsung weighs outsourcing Google TPU back-end design as 2nm demand grows

Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported...

Thursday 16 July 2026
CXMT IPO filing reveals Micron and Samsung alumni at heart of China's DRAM push

The IPO prospectus of Changxin Memory Technologies (CXMT), filed ahead of a planned listing on Shanghai's STAR Market, lays bare the...

Thursday 16 July 2026
Korean prosecutors raid Rambus, Montage, and Renesas as memory-interface chip probe goes global
South Korean prosecutors have opened a criminal front in a widening international investigation into alleged price-fixing of the small but critical chips that link AI processors to...
Thursday 16 July 2026
Samsung, SK hynix race to make Gwangju memory hub operational within four years
Samsung Electronics and SK hynix are set to anchor a KRW800 trillion (US$532.4 billion) semiconductor cluster at the former Gwangju military airport site in South Korea. Industry experts...