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Tuesday 21 July 2026
LGES accelerates sodium-ion battery plans while CATL secures early ESS lead
LG Energy Solution plans to establish a sodium-ion battery mother line at its Ochang Energy Plant in South Korea in 2026, seeking to narrow CATL's early commercial lead in energy storage...
Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
Befar begins production of 6N hydrogen fluoride gas for chipmaking

Befar Group has begun producing semiconductor-grade hydrogen fluoride gas with a claimed purity of 6N, or 99.9999%, expanding the Chinese...

Tuesday 21 July 2026
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...
Tuesday 21 July 2026
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...
Monday 20 July 2026
Memory is becoming a national security priority, SK chair warns

The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and...

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
South Korea links physical AI, AI-RAN and data centers in export strategy

South Korea is combining physical AI, domestic semiconductors, AI-RAN networks, and gigawatt-scale data centers to turn intelligent...

Monday 20 July 2026
Samsung struggles to secure AI chip substrates, report says

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Saturday 18 July 2026
LG bets on India as its biggest AC base, as its third plant runs ahead of schedule
LG Electronics is on course to bring its third Indian plant online earlier than planned, a step that would make India the company's single largest air-conditioner production base and...
Saturday 18 July 2026
Column: South Korea's semiconductor strategy faces foresight and structural gaps
South Korea's technology policies—including the two semiconductor strategies discussed previously and the broader K-Moonshot initiative introduced more recently—have been...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
TCL starts OLED monitor panel production ahead of Guangzhou fab opening
TCL CSOT has started producing a 27-inch inkjet-printed OLED monitor panel at its Gen 5.5 line in Wuhan, giving the Chinese display maker an early foothold in consumer OLED monitors...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...