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Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Saturday 11 July 2026
China's display makers raise billions to close the OLED gap — and South Korea is watching
Chinese display panel and materials companies are tapping capital markets to fund next-generation OLED, oxide and Mini LED technologies, drawing close attention from South Korea's...
Saturday 11 July 2026
Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development
South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing...
Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
Samsung plans new PC chip in push beyond smartphones
Samsung Electronics is developing a new chip for personal computers (PCs) as its System LSI business seeks growth beyond smartphone processors, according to ET News and the...
Friday 10 July 2026
SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC
SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition....
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Thursday 9 July 2026
Rebellions' IPO plan tests market appetite for inference chips
South Korean AI chip startup Rebellions is preparing for a domestic listing in the first half of 2027, offering a test of whether investor enthusiasm for inference chips can move from...
Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
AI demand pushes TSMC, Samsung to raise foundry prices — Rapidus aims to undercut 2nm

Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new...

Thursday 9 July 2026
SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Wednesday 8 July 2026
Asia VC leaders call for deeper cross-border tech investment at inaugural regional summit
Heads of venture capital associations from Taiwan, Japan, and Korea gathered in Taipei today for the first Asia Venture Capital (VC) Summit, a historic trilateral meeting aimed at...
Wednesday 8 July 2026
AI memory boom turns price hikes into antitrust flashpoint across supply chain
As AI demand drives record price increases in the memory market, the aftermath of such volatility is weighing on the wider supply chain, rippling into downstream industries where manufacturers...
Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...