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NEWS TAGGED KLA-TENCOR
Thursday 22 August 2013
KLA-Tencor to set up equipment training center in Taiwan
Semiconductor equipment maker KLA-Tencor has announced plans to invest a total of US$3 million to set up a local equipment training center in Taiwan slated for completion in April...
Wednesday 30 January 2013
KLA-Tencor intros new e-beam inspection system
KLA-Tencor has announced a new electron-beam inspection system, the eS805, which is already shipped to leading logic and chip manufacturers.
Wednesday 5 December 2012
KLA-Tencor intros new LED wafer inspection system
KLA-Tencor has announced its next-generation LED patterned wafer inspection tool, the ICOS WI-2280. Designed specifically for defect inspection and 2D metrology for LED applications,...
Thursday 12 July 2012
KLA-Tencor shipping 450mm-capable tools
KLA-Tencor has announced the installation of its first process control systems capable of handling and inspecting 450mm wafers. Fully automated, the Surfscan SP3 450 meets the demanding...
Monday 20 February 2012
KLA-Tencor shipping next-node wafer inspection tools
Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...
Friday 20 January 2012
KLA-Tencor intros flagship wafer inspection solution suite
KLA-Tencor has announced three new wafer defect inspection systems for leading-edge chip manufacturers: the 2900, Puma 9650 and eS800 systems. Designed to address a wide range of...
Tuesday 16 August 2011
New KLA-Tencor e-beam tool to accelerate defect sourcing for 20nm nodes and below
KLA-Tencor has announced a new tool for chip manufacturing at the 20nm device nodes and below: the eDR-7000 electron-beam (e-beam) wafer defect review system.
Tuesday 7 June 2011
KLA-Tencor intros new yield management solution for PV cell production
KLA-Tencor has introduced FabVision Solar, a new integrated solution designed to help PV cell manufacturers improve production yield and profitability by enabling manufacturers to...
Wednesday 24 February 2010
More industry leaders push e-beam technology
Globalfoundries, Jeol, KLA-Tencor, NuFlare Technology, Petersen Advanced Lithography and Samsung Electronics have joined the eBeam Initiative - a forum dedicated to the education...
Tuesday 15 September 2009
KLA-Tencor extends reticle inspection systems to 2Xnm
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
Wednesday 2 September 2009
KLA-Tencor keeping up R&D spending despite difficult times
R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...
Tuesday 14 July 2009
KLA-Tencor announces new inspection portfolio for 3X/2Xnm nodes
KLA-Tencor has announced two new wafer inspection systems and a new electron-beam (e-beam) review system to address defect issues at the 3Xnm / 2Xnm nodes. Each new tool can preferentially...
Wednesday 13 May 2009
KLA-Tencor and Tokyo Electron introduce new software tool to measure 3D logic and memory structures
KLA-Tencor today (May 13) launched the AcuShape 3D software modeling tool, developed with Tokyo Electron, to meet optical dimension metrology requirements for the 32nm node and bel...
Wednesday 1 April 2009
TSMC recent equipment purchases contribute one-tenth to capex estimate for 2009
Taiwan Semiconductor Manufacturing Company (TSMC) has recently spent a total of almost NT$5 billion (US$145 million) on five separate machinery equipment purchases. The amount already...
Tuesday 31 March 2009
TSMC announces equipment purchases worth NT$4 billion
Taiwan Semiconductor Manufacturing Company(TSMC) has recently announced purchases of machinery equipment from Applied Materials Asia-Pacific, Dainippon Screen Manufacturing and KLA-Tencor...