Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...
IC substrate maker Kinsus Interconnect Technology expects to see a sales decline of more than 15% in the fourth quarter, while its utilization rate will be in the 65-70% range and...
A double-digit decline in fourth-quarter demand for packaging and testing products is expected due to weak orders for IC substrates. Institutional investors forecast Nan Ya Printed...
Taiwan investors forecast that sales for IC substrate makers in the third quarter will have only single-digit growth due to weak demand for wire bonding substrates and PCBs, which...
Kinsus Interconnect Technology, which previously guided that its gross margins may hit 30% in the third quarter, revised its guidance to 27-28% as bookings for bismaleimide triazine...
IC substrate maker Kinsus Interconnect Technology has entered the photovoltaic sector via its recent investment in solar-module maker Lucky Power. Among all major IC substrate makers...
Despite recording a record-low gross margin in the second quarter of 2008, IC substrate supplier Kinsus Interconnect Technology expects a recovery for flip-chip chip-scale packaging...
IC substrate supplier Kinsus Interconnect Technology has lowered its revenues forecast for the third quarter to single-digit growth, originally the company was aiming for 10%, because...
Taiwan-based IC substrate suppliers are mostly optimistic about the third quarter, with Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology expecting strong sequential...
Demand in the memory market is showing signs of a rebound, with IC substrate supplier Kinsus Interconnect Technology and PCB maker Tripod Technology saying June-orders from the flash...
Despite trimming its second-quarter sales guidance, Kinsus Interconnect Technology said it is cautiously optimistic about the consumer electronics sales outlook in the second half...
