Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half...
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
Copper-clad laminate (CCL) supplier Iteq has announced consolidated revenues of NT$2.09 billion (US$67.8 million) for August 2018, up 9.2% on year and 4.4% sequentially.
Pure-play foundry Powerchip Technology has disclosed plans to construct two new 12-inch wafer fabs in Taiwan with total investment estimated at NT$278 billion (US$9.05 billion).
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Taiwan-based Winbond Electronics, a supplier of specialty DRAM and flash memory, saw its net profits surge to a 17-year high of NT$2.16 billion (US$70.4 million) in the second quarter...
Winbond Electronics has completed the sale of NT$10 billion (US$327.2 million) worth of secured corporate bonds in Taiwan, according to the maker of specialty DRAM and flash memory...
ASE Industrial holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), will be diversifying its offerings to satisfy growing...
DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.
Advanced Semiconductor Engineering (ASE), a provider of semiconductor assembly and test services, on April 3 held a groundbreaking ceremony at the site of its K25 building in the...
The worldwide PCB industry output value grew 11.7% to US$65 billion in 2017, according to data compiled by Taiwan Printed Circuit Association (TPCA). The on-year growth was the highest...
The annual revenues scored by firms operating in the Southern Taiwan Science Park (STSP) are expected to break the NT$1 trillion (US$33.84 billion) in the near future, as Taiwan Semiconductor...
Kaohsiung Science Park (KSP) under the Southern Taiwan Science Park (STSP) has become a cluster of medical device and material makers in Taiwan, with 73 enterprises stationed there,...
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Merck has inaugurated its first IC materials application R&D center in Asia, which will be located in Kaohsiung, southern Taiwan. More than EUR2.8 million (US$3.35 million) will...
