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    NEWS TAGGED JCET
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Tuesday 1 September 2026
    JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
    JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
    Tuesday 1 September 2026
    Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
    Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
    Friday 21 August 2026
    JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

    JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Wednesday 15 July 2026
    JCET forecasts higher first-half profit on AI-driven chip demand
    China's JCET expects stronger first-half earnings as global demand tied to artificial intelligence (AI) infrastructure lifts semiconductor activity. The outlook signals continued momentum...
    Friday 10 July 2026
    JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
    JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
    Saturday 27 June 2026
    JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

    China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Sunday 7 June 2026
    JCET opens 3D packaging plant to target AI power modules, CPO demand
    JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
    Wednesday 20 May 2026
    China's OSATs chase bigger role as AI chips strain packaging supply

    China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

    Wednesday 29 April 2026
    China OSAT leader JCET expands in advanced packaging, profit climbs
    China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
    Tuesday 14 April 2026
    JCET CEO sees robotics extending automotive semiconductor growth

    China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

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