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NEWS TAGGED JCET
Tuesday 14 April 2026
JCET CEO sees robotics extending automotive semiconductor growth

China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

Tuesday 14 April 2026
JCET advances CPO, glass substrates to capture AI packaging demand
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
Friday 10 April 2026
China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

Monday 30 March 2026
SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward
Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.
Wednesday 11 March 2026
JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

Thursday 30 October 2025
Commentary: China's JCET bets on AI to challenge global packaging giants
Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
Thursday 30 October 2025
JCET unveils Singapore blueprint for next-gen semiconductor packaging
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
Wednesday 3 September 2025
China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
Thursday 26 June 2025
Chinese chip giants multiplying subsidiaries in race for supply chain control

Amid rising US-China tech tensions and growing supply chain risks, China's top semiconductor companies are rapidly forming new subsidiaries...

Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
Monday 21 April 2025
China's JCET hits all-time high in 2024 revenue, cements global OSAT third position
JCET Group, China's top OSAT provider, reported record revenue of CNY35.962 billion (US$4.9 billion) for 2024, up 21.24% compared to the previous year. Net income attributable to shareholders...
Wednesday 5 February 2025
China fosters another IC unicorn as BYD fund moves in
As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 million. This...
Tuesday 7 January 2025
Chinese firms seek to recruit former Samsung VP amid advanced packaging talent rush
Samsung Electronics' packaging R&D chief J. C. Lin has recently resigned after a two-year tenure. Following the development, reports have emerged that Chinese semiconductor firms...
Monday 23 December 2024
TSMC's wafer manufacturing 2.0 reshapes advanced packaging market
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
Monday 9 December 2024
The Chinese government backs JCET's expansion into AI chip packaging
The Chinese semiconductor industry is making strides in building an advanced local supply chain for packaging and testing, despite the US government's export controls targeting advanced...