中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Nvidia
TSMC
AI Search
NTN Convergence
Robotics Report
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Shortage beyond memory: CPU shortages worsen PC supply chain woes, Intel 18a yield becomes new hope
Tomorrow's Headlines
5h 4min ago
Foxconn's AI-driven US factory shifts from simulation to operation with new methodology
Tomorrow's Headlines
5h 4min ago
Chinese EV makers shift from Nvidia with Nio's in-house chips surpassing 550,000 units shipped
Tomorrow's Headlines
5h 4min ago
Tesla's AI5 chip uses SK Hynix LPDDR, Samsung to manufacture in 2027
Tomorrow's Headlines
5h 5min ago
Samsung's HBM4 yield improves, 4nm PMBIST upgrade receive praise from Nvidia
Tomorrow's Headlines
5h 5min ago
Analysis: ASML raised 2026 outlook amid surging EUV demand from SK Hynix and Samsung
Tomorrow's Headlines
5h 5min ago
NEWS TAGGED JAMES FAHEY
Friday 11 July 2008
Rohm & Haas ready for 18-inch wafer and new process migration: Q&A with president of microelectronic technologies James Fahey
While number-one semiconductor equipment supplier Applied Materials projects that semiconductor companies will trim their capital expenditure (capex) by 40% in 2008, and some leading...
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
7 DAYS NEWS
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
AI compression won't ease memory crunch, NAND shortage set to persist
Samsung reportedly aims to begin silicon photonics mass production in 2028
China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
Samsung targets May HBM4E samples for Nvidia after validation
TSMC capex hits US$56 billion, reshaping global semiconductor supply chain
Amazon cuts AI data center build time from 15 weeks to 3
SkyeChip IPO signals Malaysia's push into high-value chip design
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first