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    Monday 13 July 2026
    Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

    AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

    Monday 13 July 2026
    China's Nvidia H200 pivot reveals why CUDA still rules AI

    China is preparing to allow a limited number of Nvidia H200 AI accelerators into the country, giving Alibaba, ByteDance, and DeepSeek...

    Monday 13 July 2026
    Nvidia's HVDC shift could reshape data center power chains worldwide
    Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift...
    Monday 13 July 2026
    Europe, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation
    Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing...
    Monday 13 July 2026
    Acer posts 13-year second-quarter revenue high on PC and diversified growth
    Acer reported June consolidated revenue of NT$27.818 billion (US$864.8 million), up 6.3% from May, as the Taiwanese PC maker posted its strongest second-quarter revenue in 13 years...
    Monday 13 July 2026
    India roundup: India's chip strategy tests its ability to build a competitive ecosystem

    India is moving from semiconductor planning to execution, using funding, tariff changes, foreign...

    Monday 13 July 2026
    SuperAlloy revenue climbs on recycled aluminum and semiconductor certification progress
    SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said...
    Monday 13 July 2026
    AI buildouts accelerate MLCC shortages; Taiwan firms eye 2H26 spillover orders
    As AI server supply chains move into the component stocking phase, the market for high-end passive components has heated up sharply, with tight supply of multilayer ceramic capacitors...
    Monday 13 July 2026
    Trio revenue rises on AI server battery backup demand in June
    Trio Technology said June 2026 revenue rebounded on stronger stocking demand for battery backup units used in AI servers, even as the broader second quarter remained pressured by tight...
    Monday 13 July 2026
    SK Hynix hybrid bonding push signals next phase of HBM packaging race
    SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
    Monday 13 July 2026
    Largan ramps variable aperture lens in 3Q as smartphone demand rebounds
    Optical leader Largan Precision said on July 9 that customer demand for new smartphones is picking up in the second half, while Chairman En-Ping Lin highlighted that strong technology...
    Monday 13 July 2026
    AI shifts toward 'slow thinking' as agent era approaches, says Google DeepMind's VP of research
    Ed Chi, vice president of research at Google DeepMind, said AI's next milestone will be its evolution from the fast, pattern-recognition-oriented thinking associated with System 1...
    Monday 13 July 2026
    Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
    GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...
    Monday 13 July 2026
    AI infrastructure demand lifts WPG, WT Microelectronics to record Q2 revenue

    Monday 13 July 2026
    Egis sells part of iCatch stake as ASMedia becomes largest shareholder
    Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was...
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    Oct 15, 08:00
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    GMIF 2026 Awards: Samsung, Sandisk, BIWIN, and Others Honored
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    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era