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Monday 20 July 2026
Huahsu expands capacity to tap AI and advanced packaging demand
Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...
Monday 20 July 2026
India roundup: India deepens semiconductor and AI ambitions as local ecosystem expands beyond fabs and assembly
India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as...
Monday 20 July 2026
MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference...
Sunday 19 July 2026
Interview: The pragmatic playbook behind Agility Robotics' rise

Humanoid robots are very hyped these days. They are performing ever more impressive feats, from pulling off coordinated dance performances...

Sunday 19 July 2026
Three-tier humanoid robot architecture shift opens edge AI opportunities
The humanoid robot industry is converging on a "big brain, small brain" architecture, with AI compute shifting from the cloud to the edge, and even to hands, feet, and other endpoints...
Sunday 19 July 2026
Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

Sunday 19 July 2026
The AI investment race is building its own bust, BIS paper warns
The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient —...
Sunday 19 July 2026
ASML supplier Trumpf says South Korea EUV demand is growing faster than Taiwan's
High-NA EUV lithography is becoming the semiconductor equipment industry's next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance...
Saturday 18 July 2026
China positions AI weather-warning system MAZU as a public good for the Global South, targeting 30 countries in five years
China used the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai to reframe its AI-driven weather early-warning system, MAZU, from a domestic meteorological tool into...
Saturday 18 July 2026
LG bets on India as its biggest AC base, as its third plant runs ahead of schedule
LG Electronics is on course to bring its third Indian plant online earlier than planned, a step that would make India the company's single largest air-conditioner production base and...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
TCL starts OLED monitor panel production ahead of Guangzhou fab opening
TCL CSOT has started producing a 27-inch inkjet-printed OLED monitor panel at its Gen 5.5 line in Wuhan, giving the Chinese display maker an early foothold in consumer OLED monitors...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
Saturday 18 July 2026
Trumpf recalibrates strategy as Chinese competition heats up in semiconductors, machine tools

Global suppliers are facing tougher competition as China's semiconductor and machine tool industries expand quickly, with implications...

Saturday 18 July 2026
Anthropic: AI's edge now lies in delivery, not just model strength

AI development is moving so quickly that companies and regulators worldwide have far less time to adapt, Anthropic said at the 2026...