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REALTIME NEWS
Renesas scraps SiC production plan amid rising Chinese challenge
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Semiconductors
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NEWS TAGGED INDUSTRY INTROS
Monday 28 May 2012
Smartphone and tablet industry: The view from Taiwan
Industry structure
Thursday 24 May 2012
Taiwan motherboard industry overview
Introduction to key players
Tuesday 7 June 2011
Notebook market overview
Introduction
Tuesday 7 June 2011
LCD TV overview
Introduction
Tuesday 7 June 2011
Taiwan motherboard industry overview
Introduction to key players
Tuesday 7 June 2011
Taiwan DRAM module industry overview
Overall market conditions
Friday 4 June 2010
Taiwan handset overview
Introduction
Wednesday 19 May 2010
Taiwan DRAM-module industry overview
Introduction
Tuesday 18 May 2010
A glimpse into the e-book reader market
Introduction
Tuesday 18 May 2010
Overview of LCD TV market
Introduction
Tuesday 18 May 2010
Taiwan motherboard industry overview
Introduction to key players
Tuesday 1 December 2009
Taiwan motherboard industry overview
Introduction to key players
Tuesday 25 August 2009
Taiwan notebook industry overview
Global notebook shipments grew 31.8% on year to 137 million units in 2008, of which, 91.4% were made by Taiwan makers, up from 89.5% in 2007.
Tuesday 12 August 2008
Taiwan semiconductor equipment industry overview
Introduction
Monday 9 June 2008
Taiwan motherboard industry overview
Introduction to key players
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BIZ FOCUS
May 29, 14:53
Pegatron debuted independently at Computex 2025,
showcasing AI and smart manufacturing capabilities to establish itself as a leading design and manufacturing services brand
Thursday 29 May 2025
Pegatron unveiled Verge: Cutting-edge AI hardware-ready AR smart glasses reference design at COMPUTEX 2025
Thursday 29 May 2025
PEGATRON unveils groundbreaking AI and digital transformation initiatives at GTC Taipei 2025
Thursday 29 May 2025
DATOTEK showcases AI-era memory & storage at COMPUTEX 2025, featuring immersive design and Switch 2-ready innovations
MOST-READ
7 DAYS NEWS
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Lip-Bu Tan's Intel: leaner, flatter, and betting big on packaging
Huawei reportedly erects three advanced chip fabs in Shenzhen to sidestep foreign tech
Samsung secures orders from Nintendo, paving way for future orders from Nvidia and Qualcomm
India roundup: Trump tariff threat pressures Apple on India
AIchip goes all in on CoWoS advanced packaging
China’s AI shift favors inference—and domestic players
Taiwanese manufacturers improved ability to pass tariff costs to customers
Wah Hong targets micro LED and drone battery growth
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
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