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    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Thursday 5 March 2026
    Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia

    In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...

    Thursday 5 March 2026
    Broadcom says Tomahawk switches are driving market share as AI networking demand accelerates
    On March 4, Broadcom told investors its Tomahawk family is a key competitive advantage as customers build larger AI clusters. Management highlighted Tomahawk 6 — which it described...
    Thursday 5 March 2026
    Broadcom targets $100bn AI chip revenue by 2027 as hyperscaler demand scales
    On March 4, Broadcom told investors on its fiscal first quarter 2026 earnings call that its projection of “significantly in excess of US$100 billion” in 2027 refers specifically...
    Thursday 5 March 2026
    Broadcom says five AI chip partners are ramping, OpenAI slated for 2027
    Broadcom on Monday detailed progress across its custom AI XPU roadmap, saying deployments with five major customers are advancing and that a sixth — OpenAI — is set to...
    Thursday 5 March 2026
    Broadcom posts $19.3B quarter as AI surge drives $22B revenue outlook
    Broadcom's first-quarter results and stronger-than-expected guidance underscore accelerating AI-driven demand in the data-center market, with implications for chip supply chains and...
    Thursday 5 March 2026
    WT Microelectronics sees 2026 growth despite memory price hikes
    The semiconductor market in 2026 is expected to be driven by strong AI demand but faces challenges from rising prices of memory and passive components. WT Microelectronics said the...
    Thursday 5 March 2026
    Egis showcases satellite and drone integration at MWC 2026
    Egis Technology and its subsidiaries are jointly exhibiting at the 2026 Mobile World Congress (MWC 2026). Centered on integrated terrestrial and space connectivity, physical AI, and...
    Wednesday 4 March 2026
    AGI and Snapdragon showcase private, app-agnostic AI for devices at MWC 2026
    AGI has announced a collaboration to optimize its agent technology for Snapdragon-powered devices, aiming to expand private, on-device AI capabilities across smartphones, PCs, and...
    Wednesday 4 March 2026
    Chinese fabless AI chipmakers report sharp revenue growth with divergent profitability in 2025
    Two of China's leading AI chip developers, Moore Threads and Cambricon Technologies, reported strong revenue expansion in 2025, supported by rising demand for AI computing power. However,...
    Wednesday 4 March 2026
    MediaTek and Starlink showcase satellite emergency alerts at MWC 2026
    MediaTek announced a collaboration with SpaceX's Starlink to demonstrate satellite communication technology for supporting mobile devices in receiving emergency alert services, potentially...
    Wednesday 4 March 2026
    AMD targets AI infrastructure boom with MI450 ramp and hyperscaler deals
    AMD will deepen multi‑year partnerships with Meta and OpenAI as it ramps MI450 and rack‑scale systems, while maintaining aggressive financial targets and preparing to meet...
    Wednesday 4 March 2026
    Commentary: Nvidia, MediaTek bankroll optics shift that's reshaping AI data centers
    A new trend is emerging in the AI infrastructure race. After MediaTek invested in US silicon photonics start-up Ayar Labs, Nvidia followed with US$2 billion investments in optical...
    Wednesday 4 March 2026
    Intel names Craig Barratt as chair in shift from financial oversight to engineering-led turnaround
    Intel has named Craig H. Barratt as its new independent board chair, marking what industry observers see as a decisive shift from financially driven oversight toward deeper engineering...
    Wednesday 4 March 2026
    Apple unveils M5 Pro and M5 Max with new Fusion Architecture and AI focus
    Apple's latest Mac chips mark a structural shift in its silicon roadmap, introducing a new dual-die "Fusion Architecture" for Pro models and sharpening its focus on on-device AI, even...
    Wednesday 4 March 2026
    SmartSens raises CIS prices 10-20% for Samsung, Nexchip output on memory cost pressure

    China-based CMOS image sensor (CIS) supplier SmartSens Technology has notified customers of price increases, stating that from March 1,...

    4/122 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook