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NEWS TAGGED SK HYNIX
Monday 23 June 2025
Chinese graduates seeking semiconductor jobs targeted by scams
Fresh college graduates in China looking to enter the employment force have their hearts set on major players in the semiconductor industry. However, as they rush to submit resumes,...
Friday 20 June 2025
SK Hynix widens lead over Samsung as HBM race accelerates
South Korea's top chipmakers, SK Hynix and Samsung Electronics, are heading into 2025 with dramatically diverging fortunes, as the global race for AI-driven memory dominance accelerates...
Friday 20 June 2025
Samsung and SK Hynix reportedly accelerate VCT DRAM development as stepping stone to 3D DRAM
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT...
Friday 20 June 2025
HBM divide deepens: SK Hynix diversifies, Samsung pulls in-house
SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics...
Thursday 19 June 2025
Nvidia Rubin accelerates SK Hynix's lead in HBM4 supply race
As Nvidia prepares to begin supplying samples of its next-generation AI accelerator "Rubin," industry sources report that SK Hynix is accelerating shipments of sixth-generation high-bandwidth...
Wednesday 18 June 2025
CXMT targets 2027 HBM3E launch as China races to close HBM gap
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...
Monday 16 June 2025
US fab ambitions run into red tape and local resistance
The CHIPS and Science Act has unlocked tens of billions in federal subsidies to reshore semiconductor manufacturing in the US. Yet, major projects by leading chipmakers are being...
Friday 13 June 2025
SK Hynix unveils 30-Year DRAM roadmap with Vertical Gate, 3D stack in bid to extend Moore's Law
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global...
Friday 13 June 2025
Micron reportedly clinches SOCAMM lead with Nvidia's greenlight
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
Friday 13 June 2025
Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Thursday 12 June 2025
SK Hynix warns of rockier 2H25, leans on multi-sourcing strategy
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Wednesday 11 June 2025
SK Hynix weighs TCB suppliers: Hanmi, Hanwha face off for 2H25 HBM3E equipment orders
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
Tuesday 10 June 2025
SK Hynix presents future DRAM technology roadmap at IEEE VLSI 2025
SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation...
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...