A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
Following SK Hynix's exit from the CMOS image sensor (CIS) market, Chinese vendors are aggressively scaling shipments, gaining market share, and climbing the value chain by deepening...
Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and operating profit of KRW6.7 trillion. However, its Device...
Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
Jae-Myung Lee, the presidential candidate from the Democratic Party of Korea and the frontrunner for the next presidency, recently pledged that upon taking office, he will promote...
Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential...
SK hynix (or "the company") announced today that it recorded KRW17.6391 trillion in revenues, KRW7.4405 trillion in operating profit (with an operating margin of 42%), and KRW8.1082...
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
SK hynix Inc. (or "the company") announced today that it has completed customer validation of 96GB CMM(CXL1 Memory Module)-DDR5, a DRAM solution product based on CXL 2.0.
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...
Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current...
