As a result of robust sales of its high bandwidth memory (HBM), SK Hynix's DRAM market share surged to a new peak of 35% in the third quarter of 2023, according to research firm Omdia,...
SK Hynix has begun delivering 16 gigabyte (GB) packages of LPDDR5 Turbo (LPDDR5T) memory with a data transfer rate of 9.6 gigabits per second (Gbps) to its clients, according to the...
In the third quarter of 2023, SK Hynix saw its DRAM business get out of the red thanks to increased demand for high-bandwidth memory (HBM) and DDR5. However, its NAND Flash business...
In view of the rapid growth of the AI market demand, SK Hynix has been increasing investments in products with high gross margins, such as High Bandwidth Memory (HBM) and DDR5. SK...
The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division...
SK hynix Inc. announced today that it has started commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo)*, the world's fastest DRAM for mobile with 9.6Gbps speed.
In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...
Seeing lackluster demand from the consumer electronics market for wafer foundry services, ZDNet Korea reported that SK Hynix System IC, a subsidiary of SK Hynix, is encouraging...
The United States has decided to allow exports of its semiconductor manufacturing equipment to Samsung Electronics and SK Hynix factories in China without a separate approval process,...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Despite recent price increases for memory chips, major suppliers including Samsung Electronics, SK Hynix, Micron Technology, and Kioxia may still struggle to return to profitability...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Samsung Electronics and SK Hynix are expanding the scale of their DRAM production cuts in the second half of 2023, hoping to address the issue of oversupply in the market. The South...
Samsung Electronics and SK Hynix are trying to dominate the rapidly growing high-bandwidth memory (HBM) market both through expanding capacities and revolutionizing the next-generation...
