Fresh college graduates in China looking to enter the employment force have their hearts set on major players in the semiconductor industry. However, as they rush to submit resumes,...
South Korea's top chipmakers, SK Hynix and Samsung Electronics, are heading into 2025 with dramatically diverging fortunes, as the global race for AI-driven memory dominance accelerates...
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT...
SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics...
As Nvidia prepares to begin supplying samples of its next-generation AI accelerator "Rubin," industry sources report that SK Hynix is accelerating shipments of sixth-generation high-bandwidth...
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...
The CHIPS and Science Act has unlocked tens of billions in federal subsidies to reshore semiconductor manufacturing in the US. Yet, major projects by leading chipmakers are being...
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global...
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
