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NEWS TAGGED HYNIX
Tuesday 29 November 2022
Micron to ramp up 1-beta DRAM shipments, eyeing market rebound in 2024
Micron Technology is already delivering qualification samples of DRAM chips built at its 1-beta node to select smartphone manufacturers and will kick off commercial production of...
Monday 21 November 2022
Apple reportedly to have Samsung replace YMTC for iPhone-use NAND flash supply in 2023
Apple has quietly suspended plans to purchase 128-layer NAND flash from Chinese supplier Yangtze Memory Technologies (YMTC) for iPhones targeting the China market, and reportedly...
Friday 11 November 2022
SK Hynix DDR5 and CXL solutions validated for new AMD EPYC processors
SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.
Wednesday 26 October 2022
SK Hynix announces capex cuts by 50%, and selling China fabs could be option in contingency plan
In the third quarter earnings result conference, SK Hynix Chief Marketing Officer Kevin Noh said the company is cutting its 2023 capital expenditure by more than 50% year-on-year...
Wednesday 26 October 2022
SK Hynix sees revenue and profit decrease in 3Q22
Memory chipmaker SK Hynix has reported sequential declines in revenue and operating profits for the third quarter of 20% and 61%, respectively.
Thursday 13 October 2022
SK Hynix to maintain normal production operations in China
SK Hynix has been authorized by the US Department of Commerce to receive fab tools needed for its production operations in China for one year without additional licensing requirements,...
Monday 19 September 2022
Suppliers set to enter production race for 3D NAND with 200+ layers
Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...
Friday 16 September 2022
SK Hynix invests KRW15 trillion in new chip plant; China, US-based smartphones highlight satellite communication; Nikon increases investment in 3D printing
Monday 12 September 2022
If Apple starts buying YMTC chips, Samsung, SK Hynix's good days may be numbered
According to BusinessKorea reports, for the first time, Apple is buying 3D NAND memory chips from China's YMTC, making it a supplier of components for iPhone 14, which was...
Wednesday 7 September 2022
SK Hynix to break ground for new memory fab in October
SK Hynix has disclosed plans to break ground in October for a new memory fab in South Korea, with construction scheduled to complete in early 2025.
Thursday 4 August 2022
SK Hynix develops 238-layer 4D NAND flash
SK Hynix has announced the development of its 238-layer 4D NAND flash memory, with shipments of 512Gb triple-level cell (TLC) chip samples already kicking off.
Friday 29 July 2022
Novel Crystal to utilize Ga2O3 epitaxy capacity in 2025; SK Hynix, Samsung turn conservative over 2H22 semiconductor capacity deployment; RoboSense sees surging growth in LiDAR development
Thursday 28 July 2022
SK Hynix posts record 2Q22 sales but sees challenges ahead
SK Hynix has reported record-high sales for the second quarter of 2022 but warned of a slow second half of the year for the memory market.
Monday 25 July 2022
Top-3 memory vendors to embrace RAM spec upgrades for new iPhones
The world's top-3 memory vendors Samsung Electronics, SK Hynix and Micron Technology are poised to see their mobile memory shipments get a significant boost from memory spec upgrades...
Monday 11 July 2022
Samsung, SK Hynix and Micron dominate 1Q22 smartphone memory market
The global smartphone memory market clocked a total revenue of US$11.5 billion in the first quarter of 2022, according to Strategy Analytics. Samsung Electronics, SK Hynix and Micron...
Thursday 8 February 2018
SK Hynix 4TB enterprise SSD
SK Hynix has announced the company completed recently the development of enterprise SATA SSDs built using its 72-layer 512Gb 3D NAND flash chips. SK Hynix combined the 72-layer 512Gb 3D NAND flash with its in-house developed firmware and controller to provide the maximum density of 4TB, and makes the most of its 72-layer 512Gb 3D NAND chips to double the biggest density of the SSD of the same size with 256Gb NAND chips. A single 4TB SSD could contain 200 UHD (Ultra-HD) movies, each of which is generally as large as approximately 20GB, according to the vendor. The new eSSD supports sequential read and write speed of up to 560MB/s and 515MB/s, respectively, and can perform 98,000 random read IOPS (input/output operations per second) and 32,000 random write IOPS. SK Hynix also improved the esSSD read latency.
Wednesday 20 November 2013
SK Hynix 16nm 64Gb MLC NAND
SK Hynix has started full-scale mass production of 16nm 64-gigabit (Gb) MLC NAND flash chips, according to the South Korea-based memory chipmaker. SK Hynix entered mass production of its first-version 16nm NAND flash in June, and has recently started to mass produce the second version which is more cost competitive due to its smaller chip size, the company said. SK Hynix has also developed 128Gb (16-gigabytes, 16GB) MLC chips based on the specification and endurance of 16nm 64Gb MLC, with mass production scheduled for early 2014, the company noted.
Friday 1 November 2013
SK Hynix 6Gb LPDDR3
SK Hynix has developed 6Gb low-power DDR3 (LPDDR3) using 20nm-class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, ideal for premium mobile devices, according to the chipmaker. Four 6Gb LPDDR3 chips can be stacked up and realize a high density of maximum 3GB solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to SK Hynix' 4Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand, according to the vendor. The SK Hynix 6Gb LPDDR3 works at 1866Mbps, and with a 32-bit I/O it processes up to 7.4GB of data per second in a single channel, and 14.8GB in a dual channel. It can be provided in a form of package-on-package (PoP) to mobile devices.
AROUND THE WEB
Exclusive: KLA to stop sales and service to China to comply with US export curbs
Tuesday 11 October 2022
SK Hynix to break ground on new US chip packaging plant early next year, say sources
Friday 12 August 2022
Memory chipmaker SK Hynix weighs slashing spending by a quarter in 2023
Friday 15 July 2022
Nov 30, 10:37
HealthcareEXPO TW 2022: Wincomm exhibits endoscopy AI and telehealth solutions with partners
Monday 28 November 2022
Modern desktop and innovation
Thursday 24 November 2022
With years of experience in medical power markets, Asian Power Devices showcases new products at CMEF 2022
Tuesday 22 November 2022
Fusion Worldwide named Outstanding International Branded Distributor
2023 Outlook: 8 trends to shape semiconductor industry in 2023 and beyond
2023 Outlook: China in sanction aftershock, TSMC sees limited impacts
China's imports of IC-making equipment from Dutch doubled in October
TSMC capacity utilization fall to widen in 1H23
SMIC unveils 12-inch fab expansion project over next 5-7 years
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Taiwan PC monitor shipments decreased by over 17% in 3Q22, says DIGITIMES Research
Taiwan server ODMs to see non-China capacity share rise closely to 50% by 2023, says DIGITIMES Research
Global tablet shipments rise over 20% sequentially in 3Q22 driven by Apple orders, says DIGITIMES Research
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