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May 20, 17:56
NEWS TAGGED HUAWEI
Tuesday 17 August 2021
China smartphone market and industry – 2Q 2021
Second-quarter 2021 smartphone shipments to the China market came to 72.2 million units, plunging 23.7% quarter-over-quarter.
Monday 16 August 2021
Apple orders account for over 20% of TSMC total wafer revenue
Apple has been TSMC's largest client, with its chip orders for the iPhone, iPad and Apple Watch continuing to account for more than 20% of the foundry's total wafer revenue, according...
Thursday 12 August 2021
Taiwan small- to mid-size LCD panels – 2Q 2021
Taiwan's small- to medium-size panel shipments increased 11.7% sequentially, but went down 9% on year to arrive at 209.76 million units in the second quarter of 2021.
Monday 9 August 2021
PA shipments to China for 5G base stations remain weak in 2H21
RF amplifier (PA) demand from 5G base stations in China remains weak although China telecom operators have resumed construction of 5G networks, mainly because the majority of related...
Thursday 5 August 2021
China smartphone vendors see combined shipments fall in 2Q21
China-based vendors shipped a total of 160 million smartphones worldwide in the second quarter of 2021, down 16.4% sequentially and 3.2% on year. But shipments will rebound to a 14%...
Wednesday 4 August 2021
Unisoc raises smartphone chip prices
China's Unisoc has raised its smartphone chip prices by about 25% with the new pricing becoming effective starting August, according to industry sources.
Tuesday 3 August 2021
Apple to sharply up components pull-ins for new iPhones in 2H21
Apple is expected to significantly increase its pull-ins of components shipments for new iPhones in the second half of the year, driven by its impressive growth in market share in...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Wednesday 21 July 2021
China vendors re-adopt ToF cameras for new flagship handsets
While Apple is expected to have at least its new iPhone Pro series for 2021 feature ToF-based LiDAR scanners, some Android handset vendors including China's Honor are poised to resume...
Tuesday 20 July 2021
Xiaomi benefits most from US trade curbs on Huawei
A Canalys report indicating Xiaomi outraced Apple to become the world's second largest smartphone vendor in the second quarter of 2021 is tantamount to announcing that the Chinese...
Friday 16 July 2021
CCL makers to ramp up shipments to China for 5G base stations in 2H21
Taiwan's CCL makers including Iteq and Taiwan Union Technology (TUC) will see their shipments of high-frequency/speed CCL materials for 5G base station application rise significantly...
Monday 12 July 2021
Huawei reportedly obtains China patent for Si IGBT
Huawei has reportedly obtained a patent for Si IGBT (insulated gate bipolar transistors) from China's authorities.
Thursday 8 July 2021
SAIC has no intention to build cars with Huawei
As a top player in the car supply chain, Huawei has established partnerships with many Chinese carmakers. However, one of the biggest carmakers in China, SAIC Motor, has said it has...
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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