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Commentary: How Taiwan's chip talent flow is shifting—lessons from SMIC to TeraFab
Tomorrow's Headlines
6h 16min ago
STMicro and Huahong Grace begin local production of M32 MCUs in China
Tomorrow's Headlines
6h 16min ago
Broadcom expects optical communication supply chain capacity issues to ease by 2027
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6h 16min ago
Rising Middle East conflict pressures tungsten supply in semiconductor materials
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US blocks Tianma's patent challenge against LG Display citing foreign govt influence
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Chinese automakers disrupt industry with two-year development cycles and 'run-and-fix' model
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NEWS TAGGED HSUPA
Tuesday 10 February 2009
HSPA and LTE technologies to dominate mobile telecom services by 2012, says Ericsson CTO
By 2012, HSPA (high speed packet access)- and LTE (long term evolution)-enabled technologies will account for 80% of mobile broadband services, while WiMAX related services will account...
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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TSMC leads foundry price hikes as second-tier firms see profit rebound
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Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
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HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
Tata Semiconductor secures US$735 million for Dholera chip fab with strict lender conditions
The chip gap: How Alibaba is pulling away from Tencent in China's AI arms race
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Commentary: Trump's Middle East AI data center push under threat from Iran conflict
Taiwanese supply-chain implications as India doubles down on semiconductor incentives
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Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
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