SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...
Huawei and SAIC jointly unveiled a new electric vehicle (EV) brand, SAIC Shangjie, at the Harmony Intelligent Mobility Alliance (HIMA) new product event on April 16. SAIC Shangjie...
Tencent Cloud, the cloud business of global technology company Tencent, has recently announced the signing of a Memorandum of Understanding (MoU) with PT. Bank Rakyat Indonesia (Persero)...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
In a significant development for the 10-year Taiwan Chip-Driven Industrial Innovation Program (TCIIP), certain businesses have expressed their willingness to donate 12-inch wafer...
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
The Taiwan Chip-Driven Industrial Innovation Program (TCIIP) was approved by Taiwan's National Science and Technology Council (NSTC), with implementation to start in 2024.
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
As photonic integrated circuits (PIC) begins to garner growing attention in light of its vast potential in data centers, telecommunications and automotive, the technology has also...
AI chips reportedly being developed by Tesla using heterogeneous integration are driving up demand for IC verification analysis services, according to industry sources.
