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Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Wednesday 20 December 2023
Taiwan's NSTC offers grants for local heterogeneous integration and advanced packaging EDA tools
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
Friday 1 December 2023
Suppliers optimistic about ABF substrate market in 2024, 2025
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
Friday 3 November 2023
Government accepts donation of 12-inch wafer fab equipment to bolster Taiwan's chip-driven innovation
In a significant development for the 10-year Taiwan Chip-Driven Industrial Innovation Program (TCIIP), certain businesses have expressed their willingness to donate 12-inch wafer...
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Tuesday 26 September 2023
Taiwan approves 10-year innovation program to address semiconductor industry weakness
The Taiwan Chip-Driven Industrial Innovation Program (TCIIP) was approved by Taiwan's National Science and Technology Council (NSTC), with implementation to start in 2024.
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Tuesday 5 September 2023
Dutch photonic chip industry looks to Taiwan in pursuit of a mature supply chain
As photonic integrated circuits (PIC) begins to garner growing attention in light of its vast potential in data centers, telecommunications and automotive, the technology has also...
Tuesday 15 August 2023
Heterogeneous integration for automotive AI chips reportedly driving IC analysis demand
AI chips reportedly being developed by Tesla using heterogeneous integration are driving up demand for IC verification analysis services, according to industry sources.
Friday 4 August 2023
South Korea initiates major R&D project to boost chips packaging competitiveness
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Thursday 20 July 2023
Japan is eyeing heterogeneous integration on way to mass-produce 2nm chips
As Japan is developing the technology for mass-producing 2nm chips, they are not only trying to increase the transistor density on a single die but also to combine multiple dies with...
Wednesday 19 July 2023
RAMP-C program on Intel 18A adds 2 strategic defense industrial base customers
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
2024 eXtended Reality Korea
Summary of Tech Supply Chain News!
China's homegrown NearLink wireless tech to challenge Wi-Fi dominance, says DIGITIMES Research
China's smartphone shipments threaten 20% slide in 1Q24 says DIGITIMES Research
AP shipments to Chinese smartphone brands unpleasant in 4Q23, but to stay flat in 1Q24, says DIGITIMES Research