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NEWS TAGGED GOLD BUMPING
Friday 19 August 2011
ChipMOS expects weak 3Q11
LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...
Thursday 3 March 2011
Chipbond gearing up to expand capacity for 12-inch wafers
With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...
Thursday 24 February 2011
ChipMOS to sell idle, non-core assets for US$11.6 million
Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...
Thursday 20 January 2011
Chipbond responds to media reports on 1Q11 sales
Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Friday 12 November 2010
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
Tuesday 5 October 2010
ChipMOS to expand into 12-inch gold bumping
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Monday 9 August 2010
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Tuesday 13 July 2010
UAT tripling wafer bumping capacity
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Friday 23 April 2010
Chipbond sees profits in 1Q10
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Thursday 1 April 2010
Chipbond completes merger with peer IST
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
Wednesday 25 November 2009
STATS ChipPAC moves copper wire bonding process to volume production
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Thursday 19 November 2009
One too many LCD driver IC backend service providers in Taiwan, says Chipbond
Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...
Friday 14 August 2009
Chipbond and IST urge relaxation of driver-IC backend restrictions in China
Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...
Tuesday 30 June 2009
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Tuesday 9 June 2009
Driver IC backend suppliers May sales up on improved utilization
Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...