Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...

ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...

Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...

ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...

Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...

Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...

With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...

Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...

Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...

Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).