31 news items tagged gold bumping
ChipMOS lands orders from new clients for gold bumping services
Wednesday 17 January 2018Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips
Friday 24 November 2017ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Chipbond, ChipMOS see rising orders for TDDI chips
Friday 25 August 2017Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Chipbond, ChipMOS seeing robust gold bumping demand
Wednesday 19 July 2017Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung
Wednesday 24 May 2017ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...
Chipbond grabs new gold bumping orders for power amplifiers, says report
Monday 26 December 2016Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...
Chipbond to boost sales from non-driver ICs, says report
Wednesday 29 July 2015Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...
ChipMOS sees orders for NAND flash, driver ICs pick up
Thursday 18 April 2013ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...
Chipbond 12-inch gold bumping lines to operate at full capacity in September
Tuesday 11 September 2012LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Chipbond 3Q12 sales driven by demand for small-size panel driver ICs
Tuesday 21 August 2012Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Chipbond gold bumping capacity booked for iPhones, says report
Friday 29 June 2012Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
Monday 4 June 2012LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
Chipbond, ChipMOS develop alternative to gold bumping
Tuesday 3 January 2012Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Chipbond responds to reports of price reductions
Tuesday 4 October 2011Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
ChipMOS expects weak 3Q11
Friday 19 August 2011LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...
Chipbond gearing up to expand capacity for 12-inch wafers
Thursday 3 March 2011With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...
ChipMOS to sell idle, non-core assets for US$11.6 million
Thursday 24 February 2011Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...
Chipbond responds to media reports on 1Q11 sales
Thursday 20 January 2011Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
Friday 12 November 2010LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
ChipMOS to expand into 12-inch gold bumping
Tuesday 5 October 2010Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Chipbond posts strong 2Q10 results; gives cautious outlook
Monday 9 August 2010Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
UAT tripling wafer bumping capacity
Tuesday 13 July 2010Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Chipbond sees profits in 1Q10
Friday 23 April 2010LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Chipbond completes merger with peer IST
Thursday 1 April 2010LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
STATS ChipPAC moves copper wire bonding process to volume production
Wednesday 25 November 2009STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).