FCBGA substrate supply tight on packaging demand for pre-5G chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products, leading to tight supply of FCBGA (FC ball grid array) substrates, with...

The article requires paid subscription. Subscribe Now