The European Semiconductor Manufacturing Company (ESMC), a joint venture among TSMC, Bosch, Infineon Technologies, and NXP Semiconductors, is set to begin initial production in 2027...
NXP Semiconductors and Vanguard International Semiconductor (VIS) are making steady progress on the VSMC manufacturing project, with execution now entering a more advanced stage as...
European efforts to advance sovereign AI and chip autonomy are gaining momentum, but European AI chip startups say they still primarily rely on TSMC for high-performance computing...
Europe is grappling with growing concerns over the cybersecurity risks posed by Chinese-made photovoltaic inverters, prompting discussions about restricting high-risk suppliers from...
According to an official press release, Infineon has received final approval from the German Federal Ministry for Economic Affairs to fund its new Smart Power Fab in Dresden. The company...
While TSMC's overseas fabs recorded losses throughout 2024, the Arizona facility could become profitable by year-end 2025, according to a DIGITIMES analyst, marking a potential...
TSMC has confirmed mass production at its Japanese wafer fab, marking a significant milestone in its overseas expansion strategy amid geopolitical uncertainties. While its Japan project...
The Federal Ministry for Economic Affairs and Climate Action of Germany (BMWK) has officially approved financing for TSMC's wafer fab project in Dresden. The German government has...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over EUR10...
Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
