CONNECT WITH US
NEWS TAGGED ESMC
Thursday 22 August 2024
TSMC's German fab set to offer job opportunities and promote wafer ecosystems in Europe
Dresden officially welcomed the construction of a new wafer fab by TSMC with a groundbreaking ceremony on August 20.
Wednesday 21 August 2024
TSMC breaks ground on EUR10 billion semiconductor fab in Dresden
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Wednesday 21 August 2024
TSMC maintains steady pace in EU fab expansion as competitors slow projects
Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.
Tuesday 20 August 2024
ESMC breaks ground on Dresden fab
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Thursday 15 August 2024
How ESMC project is cementing Taiwan's role in global chipmaking
Following the United States and Japan, TSMC's final overseas wafer fab, ESMC (European Semiconductor Manufacturing Company), will...
Thursday 8 August 2024
TSMC to break ground on German plant amid talent crunch
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
Friday 2 February 2024
Why TSMC's Japan experience is good for its German fab: Q&A with DIGITIMES advisor Albert Lin
Having to overcome ramps and bumps on its internationalization journey, Taiwan Semiconductor Manufacturing Company (TSMC), the world's leading pure-play foundry, is learning to act...
Friday 5 January 2024
Christian Koitzsch to become TSMC's first Europe JV head
Former Bosch Semiconductor plant manager Christian Koitzsch confirmed that he is now president of TSMC's European subsidiary, European Semiconductor Manufacturing Company (ESMC)
CPC
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research