Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...

TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...

Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products,...

MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect Bridge...