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NEWS TAGGED EARTHQUAKE
Monday 18 April 2011
PCB makers facing longer lead times for laser drills
The already-tight supply of laser drills, which are used to make equipment used in the production of high-end PCBs such as any-layer HDI boards, may worsen in the near future due to...
Monday 18 April 2011
NAND price rally slows in 1H April
Contract prices for 32Gb and 64Gb MLC (multi-level cell) NAND flash chips rose 2-3% in the first half of April, while those for lower-density 16Gb and 8Gb parts were up about 1%, according...
Friday 15 April 2011
Supply of handset image sensors hit by Japan earthquake, says IHS iSuppli
The recent earthquake in Japan is impacting the production of CMOS image sensors at two facilities in the country, affecting the supply of these parts to the mobile phone market, according...
Thursday 14 April 2011
Korea, Taiwan chipmakers turn to local wafer producers for support
Korea- and Taiwan-based foundry houses and memory-IC manufacturers have obtained support from their local producers of blank silicon wafers as failure of supplies from Japan still...
Wednesday 13 April 2011
UMC says Japan fab unaffected by aftershocks
United Microelectronics Corporation's (UMC) 8-inch wafer plant in Chiba Prefecture has not been affected by the latest aftershocks that struck Japan, continuing to run at normal capacity,...
Wednesday 13 April 2011
LED bulb penetration in Japan rising due to earthquake
As the earthquake hitting northeastern Japan is expected to raise energy-saving awareness, LED bulbs' share in Japan's lighting market increased from 17% in early March 2011 to 26%...
Tuesday 12 April 2011
FPCB makers more upbeat for 2Q11 outlook
Three Taiwan-based flexible PCB (FPCB) makers Career Technology, Flexium Interconnect and Ichia Technologies have posted sequential gains in March revenues. All of them are optimistic...
Tuesday 12 April 2011
Sony Ericsson handset shipments partially affected by earthquake, say industry sources
Sony Ericsson will reduce shipments, or delay the launch in some markets, for three Android-based smartphones due to short supply of some key components, including those from the Sony...
Tuesday 12 April 2011
DRAM contract prices up in 1H April as PC OEMs advance procurement
DRAM contract prices have gone up by about 6% in the first half of April, as PC OEMs are advancing their procurement schedules for the high season amid anticipated shortages, according...
Tuesday 12 April 2011
Corning to maintain LCD glass production levels in Japan
Corning has said that the company plans to maintain production levels at its Shizuoka and Sakai City LCD glass facilities during Sharp Corporation's temporary production curtailment...
Friday 8 April 2011
Elpida says packaging and testing unit affected by earthquake
Japan-based memory chip supplier Elpida Memory has disclosed the impact of the earthquake that occurred in northeast Japan on April 7 on its business operations.
Thursday 7 April 2011
TSMC downgrades 2011 chip growth forecast, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) has lowered its forecast for the growth of the global semiconductor market (excluding memory) to 4% from the 7% previously estimated,...
Thursday 7 April 2011
Glass yarn prices to rise on Japan supply disruption
Quotes for fiber glass yarns are likely to increase in April, mainly due to failure of supplies from Japan, according to industry sources.
Thursday 7 April 2011
Major BT resin producers recovering from Japan earthquake, say IC substrate makers
Major producers of bismaleimide-triazine (BT) resin, Mitsubishi Gas Chemical (MGC) and Hitachi Chemical, are recovering faster than expected from the suspension of operations caused...
Thursday 7 April 2011
Acer expects component shortages for tablet PCs and smartphones
Commenting about the tablet PC market, Acer Taiwan president Scott Lin pointed out that the company is currently working aggressively over its tablet PCs and is doing a marvelous job;...