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REALTIME NEWS
Samsung, SK Hynix deploy heavyweight presence at Semicon 2025 to crack Taiwan supply chain
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Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory
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NEWS TAGGED DBAAS
Monday 25 July 2022
Nutanix Taiwan gearing up for DBaaS boom
The global database-as-a-service market (DBaaS) is forecast to reach US$24.8 billion in 2025, up from US$12 billion in 2020. Nutanix is gearing up for the market boom, according to...
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
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Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
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TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
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TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
South Korea's MCP exports to Taiwan surge, debunking AI bubble concern and boosting SK Hynix outlook
Huawei launches new tri-fold smartphone with Kirin 9020 chip, targeting Samsung Electronics
China's chip equipment makers close in: eroding Japan's share, eyeing US dominance
India's chip drive gains momentum but foreign giants hold back investments
India roundup: India pushes chip ambition as tax reform unveiled
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RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
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