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Trending topic: Smart manufacturing & Robotics
NEWS TAGGED DATA STORAGE
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Tuesday 1 June 2021
Solar Applied Materials to ready new capacity for sputtering targets in 4Q21
Taiwan-based Solar Applied Materials Technology is expected to gain new growth momentum after its new facility at Southern Taiwan Science Park (STSP) starts trial production of sputtering...
Tuesday 25 May 2021
Microsoft to open Taiwan datacenter by early 2022
Microsoft is poised to open its datacenter in Taiwan at the end of this year or early 2022, according to industry sources.
Tuesday 13 April 2021
eCloudvalley partners with software vendors over digital transformation
Taiwan-based AWS Premier Consulting Partner eCloudvalley has formed strategic alliance with software solution providers such as Salesforce, SAP, Oracle and National Instruments (NI)...
Wednesday 31 March 2021
Over 65% of global GDP to come from digital products, services in 2022, says Dell Taiwan GM
The pandemic has been accelerating digital transformation at enterprises and industries worldwide with over 65% of global GDP estimated to come from digital products and services...
Tuesday 23 February 2021
Superior Plating to see profits surge in 2021
Superior Plating Technology (SPT), dedicated to metal surface treatment and electroplating processing, is expected to post significant profit growth in 2021 thanks partly to its entry...
Tuesday 14 April 2020
Yangtze Memory intros 128-layer 1.33Tb QLC 3D NAND
Yangtze Memory Technologies (YMTC) has announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working...
Monday 16 March 2020
EDA, verification support crucial to HPC packaging
High-end high performance computing (HPC) chips solutions are entailing ever-rising packaging complexity along with their increasing applications to large-size datacenters and networking...
Tuesday 17 September 2019
Taiwan startups to build smart healthcare ecosystem
Taiwan startups have come out with a variety of smart healthcare solutions and are stepping up exchanges with leading firms in diverse business segments, seeking to create more cross-industry...
Wednesday 7 August 2019
IBM sees magnetic tapes as mainstream data storage media in next decade
While data volume will expand exponentially from proliferating 5G, IoT, and autonomous driving applications, magnetic tapes will remain the mainstream data storage medium in the next...
Wednesday 29 May 2019
QSAN and Seagate join forces to boost enterprise data storage safety and security
IoT is already sweeping across industries and geographies and is starting to further combine with AI in recent years to enable AIoT, which will serve as the basis supporting business...
Thursday 21 March 2019
PCIe SSD rising as mainstream, to grab 50% market share in 2019
Driven by sharp price falls for NAND flash chips, global shipments of SSDs are estimated to surge 20-25% in 2019 from 200 million units seen in 2018, and PCIe SSDs are expected to...
Friday 16 November 2018
Taiwan first indigenous AI supercomputer set for official run in 1H19
After teaming up to set up an AI development platform in April 2018, Quanta Computer, Asustek Computer and Taiwan Mobile have joined forces with state-owned National Center for High-performance...
Tuesday 30 October 2018
Cypress enters into JV with SK Hynix foundry unit
Cypress Semiconductor announced recently the company has entered into a joint venture with SK hynix system ic, a foundry spin-off of SK Hynix.
Monday 22 October 2018
Fujitsu tapping data storage opportunities with advanced devices
As global data volume is expected to expand by 10-folds in the next five years along with the increasing applications of IoT and autonomous driving services, Fujitsu is actively leveraging...
Monday 11 June 2018
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
Monday 14 March 2016
Samsung PM1633a SSD
Samsung Electronics has announced the PM1633a, a 15.36 terabyte (TB) drive. First revealed at the 2015 Flash Memory Summit in August, the 15.36TB SSD is based on a 12Gb/s Serial Attached SCSI (SAS) interface, for use in enterprise storage systems. Because the PM1633a comes in a 2.5-inch form factor, enterprise storage managers can fit twice as many of the drives in a standard 19-inch, 2U rack, compared to an equivalent 3.5-inch storage drive. The 15.36TB of data storage on a single SSD is enabled by combining 512 of Samsung's 256Gb V-NAND memory chips. The 256Gb dies are stacked in 16 layers to form a single 512GB package, with a total of 32 NAND flash packages in the 15.36TB drive. Utilizing Samsung's 3rd generation, 256Gb V-NAND technology which stacks cell-arrays in 48 layers, the PM1633a line-up provides significant performance and reliability upgrades from its predecessor, the PM1633, which used Samsung's 2nd generation, 32-layer, 128Gb V-NAND memory. The PM1633a SSD sports random read and write speeds of up to 200,000 and 32,000 IOPS respectively, and delivers sequential read and write speeds of up to 1,200MB/s. Starting with the 15.36TB density, Samsung will provide a wide range of capacity options in its PM1633a SSD line-up - 7.68TB, 3.84TB, 1.92TB, 960GB and 480GB later this year.
Sep 8, 14:22
GIGAIPC addressing industrial solutions solving smart manufacturing impacts to transform and develop the ability for the future
Tuesday 7 September 2021
The best power supply choices for blockchain industrial applications
Monday 6 September 2021
SINTRONES event addressing AIoT, fleet management solutions levering 5G technology
Friday 3 September 2021
MSI AMR-AI-PJ-UVGI Robot verified by Texcell/France effectively inactivate new SARS-COV2 virus within seconds under research conditions
US chip vendors increasingly shift orders from China foundries
Intel offering competitive prices to maintain server market leadership
Taiwan 1st-tier IC design houses poised to raise prices in 1Q22
Apple to place orders for around 90 million units of iPhone 13 series for 2021
SMIC to build additional, considerable 28nm and above process capacity
Apple to place orders for around 90 million units of iPhone 13 series for 2021
Unisoc to see smartphone AP shipments hike in 2H21
Digitimes Research forum talks about trends in 5G industry
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