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NEWS TAGGED CULV
Thursday 14 May 2009
Nan Ya PCB begins shipments of HDI boards for CULV notebooks
Nan Ya Printed Circuit Board (NPC) began shipments of high-density interconnect (HDI) boards for CULV notebooks this month and expects shipment volumes to increase progressively throughout...
Tuesday 12 May 2009
Intel outlines notebook plans for 2H09
Intel recently outlined its plans for traditional notebook, CULV-based ultra-thin notebook and netbook product lines for its partners, according to sources at notebook makers.
Friday 8 May 2009
Compal expects notebook shipments to grow 15-20% sequentially in 2Q09, says company president
Compal Electronics expects its second-quarter notebook shipments to grow 15-20% to 7.2-7.5 million units from 6.3 million units shipped in the first quarter, company president Ray...
Tuesday 5 May 2009
Six Taiwan-based notebook makers preparing white-box CULV shipments
Six Taiwan-based notebook makers are preparing to launch CULV-based ultra-thin notebooks for the white-box market, according to industry sources in Taiwan.
Monday 4 May 2009
Wistron forecasts notebook shipments to reach 6.1 million units in 2Q09
Wistron forecasts its notebook shipments for the second quarter of 2009 to grow 10-15% sequentially to 5.8-6.1 million units, up from 5.3 million units in the first quarter, according...
Monday 4 May 2009
Pegatron turns to second-tier brand and local channel vendors for notebook orders
Pegatron Technology has turned its focus from targeting first-tier brand notebook vendors to second-tier and local channel vendors in each region, according to sources at channel...
Thursday 30 April 2009
Atom market on track, says Intel
While recent market reports have some makers claiming that demand for the Intel Atom processor is slowing while other players, notably in the China market, are saying that supply...
Wednesday 29 April 2009
Ultra-thin notebooks to drive Inventec shipment growth in 2009
Taiwan-based Inventec has landed several CULV-based ultra-thin notebooks orders from Acer including 13.3-inch models, which will start shipping in May-June this year, 15.6-inch models,...
Tuesday 28 April 2009
More use of HDI for TFT-LCD panels happening in notebooks, say Taiwan makers
More notebook makers are starting to adopt high-density interconnect (HDI) boards for the TFT-LCD panels in their notebooks, and the use of HDI boards in notebooks is expected to...
Monday 27 April 2009
Gigabyte lands netbook motherboard orders from China-based vendor
Gigabyte Technology has received orders for netbook-use motherboards from a China-based branded netbook vendor, and the company is approaching other white-box vendors for more orders,...
Monday 27 April 2009
Demand for Intel Atom processors slowing
Demand for Intel's Atom netbook processors has begun to slow down as the netbook market faces price-cut competition from low-end notebooks as well as the launch of CULV-based notebooks,...
Friday 24 April 2009
AUO expects LED notebook panel penetration to reach 80% in 2Q09
AU Optronics (AUO) estimates its LED notebook panel shipment share will increase to 80% of total notebook panel output in the second quarter from 60% in the first quarter, driven...
Tuesday 21 April 2009
Asustek choice of 1.3-megapixel CMOS image sensor for CULV notebook questioned by CIS makers
Asustek Computer has decided to adopt a 1.3-megapixel CMOS image sensor (CIS) for its consumer ultra-low voltage (CULV) notebook models to be launched in the second half of 2009,...
Friday 17 April 2009
Tight supply of ultra-thin LCD panels may undermine Acer CULV notebook shipments
Tight supply of 16:9 aspect ratio ultra-thin LCD panels could undermine Acer's efforts in trying to unseat rival vendor Hewlett-Packard (HP) from the number one spot in the global...
Wednesday 15 April 2009
Compal reportedly to make ultra-thin notebook for Dell, says paper
Compal Electronics has landed ultra-thin notebook orders using Intel's CULV CPUs from Dell which are expected to start shipping in August, according to a Chinese-language Commercial...
Research Report Database
Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research