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Friday 5 June 2026
South Korea finalizes US$520 million on-device AI chip budget amid industry doubts
South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal,...
Friday 5 June 2026
Foxconn deepens AI push with Intel on inference racks
Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal...
Friday 5 June 2026
HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI
Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems,...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market
Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly...
Friday 5 June 2026
CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert
More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies...
Friday 5 June 2026
Memory crunch pushes low-end smartphones toward 2026 breaking point
The global smartphone market performed better than expected in the first quarter of 2026 after some brands pulled forward orders, but shipments still fell by about 3.1% from a year...
Friday 5 June 2026
Commentary: Memory boom driven by DRAM now, but HBM will decide future
AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...
Friday 5 June 2026
Arm says Taiwan powers its rise as agentic AI lifts PC growth
Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI...
Friday 5 June 2026
TSMC CEO says rising profits mean greater social responsibility, clarifies bonus considerations
Taiwan Semiconductor Manufacturing Company (TSMC) held its shareholders meeting on June 4, during which CEO C.C. Wei addressed recent talk surrounding its employee bonus system. He...
Friday 5 June 2026
TSMC says AI demand is straining entire supply chain, not just chipmakers
TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment,...
Friday 5 June 2026
Hiwin targets logistics automation with Dexterity dual-arm robot
Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
Friday 5 June 2026
Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
Friday 5 June 2026
AI energy demand drives a shift to vertical power delivery and smaller modules
As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the...
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...