Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening...

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft,...

Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters...

Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten...

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down...

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...