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Friday 6 February 2026
The Kumamoto master plan: behind TSMC's strategic leap to 3nm supremacy
TSMC is doubling down on Japan. By upgrading its second Kumamoto facility to 3-nanometer production, the chipmaking giant has turned what was once a secondary supply-chain hedge into...
Friday 6 February 2026
YMTC Phase III speeds Wuhan fab installations and domestic equipment deliveries
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
Friday 6 February 2026
Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
Friday 6 February 2026
ASE expects advanced packaging and testing revenue to double in 2026
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Friday 6 February 2026
Rapidus draws US$1b in private capital to revive Japan's leading-edge chip ambitions
Japanese semiconductor startup Rapidus has secured more than JPY160 billion (US$1.02 billion) in private funding for fiscal 2025, surpassing its initial JPY130 billion target, according...
Friday 6 February 2026
Infineon announces price hikes up to 25%; Taiwanese power semiconductor makers plan to follow in 2Q26
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
Friday 6 February 2026
CSPs turn to custom silicon to break Nvidia dependence
The global boom in generative artificial intelligence is driving an insatiable demand for computing power. This is pushing the world's largest cloud service providers to rethink a...
Friday 6 February 2026
PSMC narrows losses as DRAM prices and AI demand boost revenue
Powerchip Semiconductor Manufacturing Corporation, one of Taiwan's smaller but strategically positioned chipmakers, reported a sharp narrowing of losses in the fourth quarter of 2025,...
Friday 6 February 2026
ASE Technology posts 3-year profit high on strong advanced packaging orders in 4Q25
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Friday 6 February 2026
Google doubles AI capex, turning TPU ASIC orders into high-stakes supplier race
Google's latest earnings showed not only solid operating momentum but also an unprecedented surge in capital spending, with capex set to more than double from US$91.45 billion in 2025...
Friday 6 February 2026
Nittobo targets 2028 launch for next-generation glass fiber cloth
Nitto Boseki (Nittobo), which currently holds around 90% market share in the semiconductor materials glass fiber cloth segment, is planning to launch its next-generation T-glass glass...
Friday 6 February 2026
Qualcomm 1QFY26 earnings call: memory shortages redefine smartphones despite strong demand
Qualcomm delivered record results in its fiscal first quarter, but executives warned that a worsening memory supply imbalance is now constraining the global smartphone market, even...
Friday 6 February 2026
Cerebras raises US$1 billion, valuation nearly triples in 6 months
AI chip startup Cerebras Systems has secured a US$1 billion funding round, boosting its valuation to US$23 billion. According to Reuters and Bloomberg, the latest...
Friday 6 February 2026
CHPT sees AI, AP drive load board shipments with January revenue up
Chunghwa Precision Test Tech (CHPT) reported year-over-year and month-over-month revenue growth in January. The surge was mainly driven by strong demand for AI, application processor...
Thursday 5 February 2026
Arm pushes compute subsystems as chip design complexity grows
Arm Holdings executives highlighted a growing focus on integrated compute subsystems during the company's latest earnings call, as rising chip design complexity reshapes customer requirements...