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Sunday 16 August 2026
AI reshapes semiconductor testing as KYEC pushes four-way model

As AI chip value and integration complexity keep rising, King Yuan Electronics (KYEC) President Gauss Chang said semiconductor testing...

Sunday 16 August 2026
AI product cycle lifts Chroma test demand
AI is sharply increasing demand for test and measurement equipment, turning it from a cost-cutting support tool into a must-have, said Chroma president I-Shih Tseng. He said he expects...
Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Saturday 15 August 2026
Interview: Acrab CEO Ken Phua on building agentic AI silicon in Singapore
Ken Phua, former Arm China co-CEO, spent 25 years abroad building someone else's business model. He came home to Singapore to build his own.
Friday 14 August 2026
SK hynix scouts US memory fab sites as customers seek local supply
SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production...
Friday 14 August 2026
South Korea chip cluster could expand to nine fabs as SK plans new investment
South Korea's planned southwestern semiconductor cluster could eventually expand from four fabs to as many as nine as the government accelerates land, power, and infrastructure work...
Friday 14 August 2026
China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands

Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger...

Friday 14 August 2026
South Korea's memory-chip exports surge 277% as system chips slip

South Korea's semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over...

Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026
Podcast highlights: Intel raises US$20B, but its 14A ambitions may need twice as much

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting...

Friday 14 August 2026
SanDisk lays out multiyear NAND roadmap and AI storage targets at investor day

SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry...

Friday 14 August 2026
MPI posts record 2Q26 revenue, profit as probe card capacity stays fully loaded

Taiwanese test interface provider MPI said that continued strong expansion demand from global artificial intelligence (AI) customers,...

Friday 14 August 2026
Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
Suzhou Novosense Microelectronics expects to return to profitability in the first half of 2026, with revenue rising nearly 67% as demand for AI computing infrastructure, automotive...
Friday 14 August 2026
AMD reportedly to issue up to US$5B in bonds amid tech debt sale wave
Advanced Micro Devices (AMD) is launching up to US$5 billion in debt offerings, part of a wave of tech companies reaching for capital markets to fund investments in AI-driven technologies...
Friday 14 August 2026
Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...