Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
Moody's has sharply raised its forecast for South Korea's 2026 economic growth to 3.5%, saying the country's semiconductor boom and export strength will last longer than expected and...
Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
Nvidia is aggressively expanding into open-source models and positioning itself as the world's largest open AI contributor, as CEO Jensen Huang reshapes the company from a supporter...
Weltrend Semiconductor said first-half 2026 revenue rose 28% from a year earlier to a record for the period, with growth driven almost entirely by cooling demand tied to AI data center...
Xiaomi is expanding Xring from a smartphone chip program into a broader AI computing platform spanning consumer devices, vehicles, and edge inference, with three processors assigned...
China's contract chipmakers spent the first half of 2026 proving something narrower than the headlines suggest. They demonstrated that domestic fabs can run at full capacity, raise...
Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related...
Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
Amazon Web Services (AWS) and Nvidia are expanding their collaboration to add millions of GPUs and new infrastructure for agentic and physical AI. The move signals rising global demand...
The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
