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Monday 23 March 2026
Weekly news roundup: geopolitics, AI memory, racing for semiconductor control
Below are the most-read DIGITIMES Asia stories from the week of March 16-22, 2026:
Monday 23 March 2026
Can Elon Musk's Terafab turn chip independence into reality—or is it too ambitious to succeed?
Elon Musk has unveiled one of his most ambitious industrial visions yet: a "Terafab" that would allow Tesla and SpaceX to design and manufacture their own semiconductors for artificial...
Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth...
Monday 23 March 2026
Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into...
Monday 23 March 2026
Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for...

Monday 23 March 2026
Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026
Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to...
Monday 23 March 2026
India roundup: India eyes key hub for semiconductors, clean energy, and advanced manufacturing

India is rapidly positioning itself as a strategic hub for semiconductors, clean energy, and advanced...

Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
Sunday 22 March 2026
TSMC chairman C.C. Wei on why the robotics future is forged in silicon, not stunts
TSMC Chairman C.C. Wei contrasted viral videos of acrobatic robots from China with the functional requirements of high-performance service robotics, noting that mechanical agility...
Saturday 21 March 2026
Taiwan legislature blocks science budget; Minister defends industry
The National Science and Technology Council (NSTC) held its 20th committee meeting on March 18, 2026, where industry players expressed concerns over the science research budget being...
Saturday 21 March 2026
AMD-backed Upstage targets 10,000 GPUs in Korea AI expansion
Advanced Micro Devices is expanding its presence in South Korea's artificial intelligence market through a deepened partnership with local startup Upstage, as plans for large-scale...
Saturday 21 March 2026
SK Hynix targets autonomous fabs by 2030 to tackle AI-driven manufacturing challenges
SK Hynix is targeting the development of autonomous semiconductor fabrication facilities by 2030 as it seeks to address rising AI-driven demand and increasing manufacturing complexity,...
Saturday 21 March 2026
Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The...
Saturday 21 March 2026
Supermicro reshuffles its board as scrutiny deepens
Super Micro Computer Inc. (Supermicro) has announced a swift and significant restructuring of its executive leadership following the unsealing of a federal indictment charging its...