CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Monday 8 December 2025
SK Hynix restructures global operations amid reported HBM4 production delay
SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
Monday 8 December 2025
TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

Monday 8 December 2025
China expected to surpass Taiwan as second-largest IC design revenue generator by 2026, IDC forecasts
According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue...
Monday 8 December 2025
Weekly news roundup:Intel hires TSMC veteran, Samsung reportedly wins TPU HBM4 order
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Samsung shifts focus from HBM to DDR5 modules for higher profits
Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition, reallocating capacity toward DDR5 RDIMM modules and freeing up around 80,000...
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

Monday 8 December 2025
Huawei's Peter Zhou says China's storage stack is stressed yet still primed for global standing
China's storage industry is at a critical juncture. Surging AI workloads have fuelled a global shortage of high-bandwidth memory (HBM) and pushed storage to the forefront of the semiconductor...
Sunday 7 December 2025
Taiwan poised to benefit as Japan and Korea shift capacitor output to premium markets
Japanese and Korean passive-component makers are diverting more capacity to high-end capacitors used in AI servers, tightening supply in mainstream electronics, and creating new openings...
Sunday 7 December 2025
Taiwan's ESMT sees memory upturn accelerating as pricing gains roll into 4Q25
Tight memory supply has lifted prices across product lines, allowing Elite Semiconductor Microelectronics Technology (ESMT) to break a two-quarter losing streak in the third quarter...
Sunday 7 December 2025
South Korea bets on airport GSE to break 90% power chip import lock
South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric...
Saturday 6 December 2025
Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV
A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal...