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NEWS TAGGED AMD NEO
Friday 16 January 2009
AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
Wednesday 7 January 2009
AMD delivers new platform for ultra-thin notebooks
AMD has announced the availability of an new AMD platform for ultra-thin notebooks.