Microsoft has expanded its strategic partnership with AMD, announcing plans to deploy the company's upcoming Helios rack-scale AI system...

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

The AI infrastructure order boom is spilling into the second half of 2026, and server supply-chain players are turning increasingly...

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long...