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    Why Shanghai is becoming China’s center for lithography
    1h 51min ago
    Beijing’s AI hub takes shape as Moonshot and Z.ai vie for talent and capital
    1h 51min ago
    Beyond compute: how memory and storage became the next contested field of automotive semiconductors
    1h 51min ago
    German joint ventures in China fell below 50% utilization as car market restructuring intensified
    1h 51min ago
    Research Insight: What CXMT IPO signals amid DRAM industry shift
    1h 51min ago
    NEWS TAGGED AMD
    Friday 24 July 2026
    AMD says AI shift to inference and agents will reshape data centers
    AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents,...
    Friday 24 July 2026
    AMD Advancing AI 2026: Gorgon Halo brings 300-billion-parameter models to local AI with Cisco governance
    Agentic AI is spreading rapidly across personal computers and enterprise endpoints, prompting AMD to expand its local AI strategy with a new platform capable of running significantly...
    Friday 24 July 2026
    AMD redraws server chip strategy as AI workloads evolve
    AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping...
    Friday 24 July 2026
    AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center
    AMD unveiled its sixth-generation EPYC 9006 server processors, widening its push into AI data centers with chips designed for agentic AI, cloud computing, enterprise workloads, and...
    Friday 24 July 2026
    AMD sees AI demand broadening beyond chips, as Helios ramps toward shipment
    AMD CEO Lisa Su said demand from cloud service providers and enterprise customers continued to climb rapidly, reinforcing AMD's view that the artificial intelligence (AI) market still...
    Friday 24 July 2026
    AMD unveils Helios rack-scale AI platform to target hyperscale buildouts
    AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...
    Friday 24 July 2026
    AMD splits next-generation data center GPUs for specialized AI demand
    AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the...
    Friday 24 July 2026
    AMD goes all-in on ecosystem strategy to challenge Nvidia
    AMD used its Advancing AI 2026 conference in San Francisco this week to do more than launch new hardware — it put its entire AI ecosystem strategy on display in a direct challenge...
    Thursday 23 July 2026
    Server CPUs are AI boom's next scarce commodity: Intel, AMD reportedly lock in Chinese buyers
    The AI build-out has found its next pinch point. After spreading from Nvidia's accelerators to memory and networking gear, the scramble for capacity has now reached the once-plentiful...
    Thursday 23 July 2026
    AMD lands Anthropic as its third marquee AI customer, chipping at Nvidia's grip on training silicon
    Advanced Micro Devices has signed Anthropic to a multi-year supply-and-investment pact worth tens of billions of US dollars, a deal that hands the chipmaker its third top-tier artificial-intelligence...
    Tuesday 21 July 2026
    Microsoft expands Azure partnership with AMD ahead of Helios AI system launch

    Microsoft has expanded its strategic partnership with AMD, announcing plans to deploy the company's upcoming Helios rack-scale AI system...

    Monday 20 July 2026
    MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
    MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference...
    Friday 17 July 2026
    Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

    Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

    Saturday 11 July 2026
    Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

    Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

    Saturday 11 July 2026
    SunplusIT clears Intel and AMD eUSB hurdle, starts thermal imaging shipments ahead of July listing
    Sunplus Innovation Technology (SunplusIT) said on July 9, 2026, that it is preparing to become a listed company in mid-July 2026 and outlined its view on market conditions in the second...
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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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