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Wednesday 11 November 2026
Alibaba files to spin off chip design unit T-Head for Hong Kong IPO
Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking...
Wednesday 11 November 2026
Powerlogic revenue falls 39% as AI chip shortages hit gaming
Powerlogic said the rapid growth of global AI applications has diverted chips and key components toward the AI market, disrupting gaming hardware supply chains and customer purchasing...
Wednesday 11 November 2026
China's Nebula project links AI chips to satellites in bid to take computing beyond Earth

Rising AI demand and constraints on power, land and cooling at terrestrial data centers are drawing international interest in space computing....

Tuesday 10 November 2026
Commentary: How will US midterms and Jensen Huang controversy reshape AI policy?
Recent developments, including the Democratic Party's strong showing in the US midterm elections and calls for Nvidia CEO Jensen Huang to brief Congress on national security matters,...
Tuesday 10 November 2026
Nvidia probe fuels push for China chip curbs, raising risks for Samsung, SK Hynix
Samsung Electronics and SK Hynix face uncertainty over demand for high-bandwidth memory (HBM) as US lawmakers press for tighter controls on AI chip exports to China following allegations...
Tuesday 10 November 2026
Commentary: Why Nvidia's board would struggle to replace Jensen Huang
Nvidia CEO Jensen Huang's personal relationship controversy continues to widen, now spanning US national security, AI chip export controls, and corporate governance.
Monday 9 November 2026
Nvidia teams up with SK Telecom and Rebellions to develop AI inference systems
Nvidia, SK Telecom and South Korean AI chip startup Rebellions have agreed to develop rack-scale AI inference systems that combine Nvidia GPUs with Rebellions' next-generation neural...
Monday 9 November 2026
Semiconductor testing company KYEC keeps US AI chip testing plant on track despite election shift
King Yuan Electronics (KYEC) general manager Gauss Chang said the company's plan to establish a US testing facility in Texas remains on schedule despite concerns that a shift in control...
Thursday 5 November 2026
US pressure on overseas AI compute squeezes Chinese tenants and Southeast Asian data centers as Beijing pushes domestic chips
Chinese AI developers are losing a key route to advanced US chips, renting them in data centers outside China, as Washington and US companies stretch American controls over compute...
Wednesday 4 November 2026
Decoy processors carry Korean HBM past US export controls into China
A loophole in US export controls reportedly lets high-bandwidth memory (HBM) made by Samsung Electronics and SK Hynix reach China's AI chip industry. The loophole shows how much Huawei's...
Tuesday 3 November 2026
Analysis: AI supply chain expansion persists despite concerns over a downturn
AI chip and data center suppliers continue to announce capacity expansions and stronger earnings in response to surging AI demand, even as concerns grow over the sustainability of...
Monday 2 November 2026
Samsung's Lee bets on Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...
Monday 2 November 2026
FuriosaAI raises US$620 million, quadruples valuation to challenge Nvidia
South Korean AI chip startup FuriosaAI has raised US$620 million in its latest funding round, quadrupling its valuation from the previous round to US$2.9 billion and strengthening...
Friday 30 October 2026
HyperAccel, Rebellions look beyond chips to AI data center systems
South Korean AI chip developers HyperAccel and Rebellions are moving beyond standalone accelerators to develop integrated data center systems, seeking to combine domestic processors,...
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.