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NEWS TAGGED AI CHIP
Tuesday 9 June 2026
Tencent takes dual-track AI chip route with Canghai V2 and domestic partnerships
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
Cooling parts maker Global PMX wins AI server liquid-cooling supply and expects high-margin shipments in second half
Automotive power and safety parts manufacturer Global PMX said it secured placements in the supply chains of leading AI chip and rack makers and expected a wave of high-margin liquid-cooling...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron,...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Tuesday 2 June 2026
TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
Tuesday 2 June 2026
Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...
Friday 29 May 2026
From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At...
Friday 29 May 2026
Malaysia's Oppstar revises AI chip deal, formalizes US$2.9 million design contract
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement...
Thursday 28 May 2026
FuriosaAI and Broadcom partner on AI inference platform for agentic computing era
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...
Thursday 28 May 2026
Commentary: China's AI chip certification becomes new market gatekeeper
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something...