Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...
Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...
Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator...
Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...
Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen...