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Wednesday 22 July 2026
TSMC raises 2027 chip prices, giving Intel fresh pricing room

TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion...

Wednesday 22 July 2026
WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip...

Wednesday 22 July 2026
China weighs stricter AI and chip export curbs after Kimi K3 benchmark win

China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition...

Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...
Tuesday 21 July 2026
AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer...
Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Tuesday 21 July 2026
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...
Monday 20 July 2026
Alibaba open-sources AI chip software, launches Zhenwu cloud supernode service
Alibaba Group's chip design unit, T-Head, has open-sourced the software stack behind its Zhenwu AI processors while extending the platform from individual accelerators into rack-scale...
Monday 20 July 2026
Samsung struggles to secure AI chip substrates, report says

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
Thursday 16 July 2026
China's TPU path gains traction with low-cost AI inference challenging GPU economics

Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator...

Thursday 16 July 2026
Apple reportedly explores AI chip acquisitions as it races to strengthen its infrastructure
Apple is exploring acquisitions of semiconductor companies to accelerate development of AI server chips, reflecting mounting pressure to improve the computing infrastructure behind...
Wednesday 15 July 2026
China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints

Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an...