ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
ACM Research Shanghai, one of the major semiconductor equipment providers in China, decided to postpone the operation of its R&D facility in Shanghai to mid-2025.
Chinese semiconductor equipment suppliers, such as Advanced Micro-Fabrication Equipment (AMEC) and ACM Research Shanghai, have strengthened their competitiveness by capturing domestic...
