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Wednesday 13 January 2010
Hynix intros 2Gb DDR2 for mobile applications
Hynix Semiconductor has developed 2-gigabit (2Gb) low-power DDR2 DRAM for mobile applications such as smartphones and tablet PCs, with volume production slated for the first half...
Wednesday 13 January 2010
Xilinx says delivery of 40nm generation products progressing smoothly
Xilinx is working closely with its foundry partners, and sees no supply constraints on 40/45nm FPGAs, according to Fai Yeung, vice president of sales for Xilinx Asia Pacific. Demand...
Wednesday 13 January 2010
Foundry chipmakers see yields for 40nm production below 70%
Foundry chipmakers, including Taiwan Semiconductor Manufacturing Company (TSMC), have been struggling to increase their yields on 40nm to over 70%, according to industry sources....
Tuesday 12 January 2010
Rexchip ramping DDR3 output
Rexchip Electronics has said it is scheduled to increase its DDR3 wafer starts share to 70% and production share to 50% in the first quarter of 2010. DDR3 accounted for 40% of its...
Friday 8 January 2010
CES 2010: AMD unveils DirectX 11-ready mobile graphics
AMD has introduced its lineup of next-generation DirectX 11-capable ATI Mobility Radeon Premium graphics chips for notebooks, including the highest-end ATI Mobility Radeon HD 5870.
Wednesday 6 January 2010
Elpida, Rexchip start 40nm era
Elpida Memory recently conducted pilot production of 2Gb DDR3 chips using 40nm coupled with 6F2 process technology at its Hiroshima fab, and has raised yield rates high enough for...
Monday 21 December 2009
Hynix announces 2Gb GDDR5 using 40nm-class technology
Hynix Semiconductor has announced what it claims is the industry's first 2Gb GDDR5 memory using 40nm-class process technology for PCs and games consoles.
Friday 27 November 2009
PSC to see 30-40% DRAM bit growth in 4Q09
Taiwan-based Powerchip Semiconductor Corporation (PSC) is speeding up capacity expansion on a recovery in market demand, and its fourth-quarter DRAM bit growth is likely to reach...
Friday 20 November 2009
Hynix announces 40nm 2Gb DDR3
Hynix Semiconductor has announced Intel validation of 2Gb DDR3 DRAM chips using 40nm-class process technology. The chipmaker said it has begun mass producing the new chips, and expects...
Tuesday 17 November 2009
DRAM production costs to drop significantly in 2010, say Taiwan makers
With more DRAM producers progressing to next-generation production process, the competition in die shrink will cause an overall reduction in DRAM production costs in 2010, according...
Monday 9 November 2009
Nvidia Fermi push-back to 2010 not expected to impact sales, say sources
Nvidia's decision to push back the launch of its next-generation flagship GT300 (Fermi) GPU to the first quarter of fiscal 2011 (January 26-April 26, 2010) is unlikely to affect the...
Thursday 5 November 2009
AMD GPU shortage causing PC vendors to delay products to 1Q10
Tight supply of AMD GPUs has caused several PC vendors to delay their mass shipment schedules by about two months to the first quarter of 2010, according to sources at the companie...
Wednesday 4 November 2009
UMC to offer more incentives to employees
United Microelectronics Corporation (UMC) has decided to distribute performance bonuses among its employees as an incentive to reinforce loyalty. The foundry also plans to sell treasury...
Friday 30 October 2009
TSMC 40nm yield issues resurface, CEO promises fix by year-end
Taiwan Semiconductor Manufacturing Company (TSMC) has revealed it recently run into issues with its 40nm process technology impacting yields. Company chairman and CEO Morris Chang...
Thursday 29 October 2009
TSMC 3Q09 profits almost flat; sees more sales from 45/40nm
Taiwan Semiconductor Manufacturing Company (TSMC) has announced net income of NT$30.55 billion (US$939 million) on consolidated revenues of NT$89.94 billion for the third quarter...