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NEWS TAGGED 3D FABRIC
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Monday 26 June 2023
TSMC to build new CoWoS capacity in central Taiwan
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Friday 2 June 2023
Keysight joins TSMC OIP 3D Fabric Alliance
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Thursday 8 December 2022
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Thursday 24 November 2022
Taiwan, Japan poised to expand cooperation in semiconductor, 5G, EV
Taiwan and Japan already have complementary cooperation in 5G and semiconductor, and the cooperation will likely expand to electric vehicles (EV) and green energy, according to Taiwan's...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 22 August 2022
AMD seen not to hike prices for mainstream core chips for PCs
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
Monday 18 July 2022
TSMC on track to develop InFO_3D tech for mobile device chips
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
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Summary of Tech Supply Chain News!
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