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NEWS TAGGED 3D FABRIC
Thursday 8 December 2022
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Thursday 24 November 2022
Taiwan, Japan poised to expand cooperation in semiconductor, 5G, EV
Taiwan and Japan already have complementary cooperation in 5G and semiconductor, and the cooperation will likely expand to electric vehicles (EV) and green energy, according to Taiwan's...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 22 August 2022
AMD seen not to hike prices for mainstream core chips for PCs
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
Monday 18 July 2022
TSMC on track to develop InFO_3D tech for mobile device chips
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Feb 3, 10:12
AMD EPYC CPU delivers powerful impetus with high performance in "Kawas", the soul of computing built by ASIAA
Friday 3 February 2023
Foodland Ventures optimistic about prospect of Taiwan agrifood tech amid global automation and digitization trends
Thursday 2 February 2023
Wolfspeed Silicon Carbide devices power future Mercedes-Benz Electric Vehicle platforms
Thursday 2 February 2023
WeMo strives to make Taiwan role model in global digital economy
With US notebook chip procurement moving away from China, can IC design houses in Taiwan benefit from order transfers?
Foundry fabs may see automotive clients cut back on orders
ASML 4Q22 results defy US ban on chip technology exports to China, says analyst
Intel to cut PC processor prices by as much as 20%
Apple developing micro LED to become technology leader
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
DIGITIMES Research: Emerging EV companies use contract manufacturing to break entry barriers
Global smartphone shipments to perform weaker than expected in 2H22 and 2023, says DIGITIMES Research
Global sales of EV to surpass 14 million units, with 9 million in China, says DIGITIMES Research
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