Out in Front
Tuesday 31 October 2023
TSMC fab investments buoying STSP revenue
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Monday 26 June 2023
TSMC to build new CoWoS capacity in central Taiwan
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Friday 9 June 2023
TSMC opens new advanced backend fab
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...
Wednesday 7 June 2023
Apple UltraFusion relies on TSMC 3DFabric packaging technology
Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.
Friday 2 June 2023
Keysight joins TSMC OIP 3D Fabric Alliance
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Thursday 27 April 2023
TSMC talks about enhanced N3E and other 3nm variants
At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Thursday 19 January 2023
Samsung to grow foundry IP partner ecosystem
Samsung Electronics reportedly is looking to boost its semiconductor IP sales by working closely with silicon IP and design service companies.
Thursday 8 December 2022
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Thursday 24 November 2022
Taiwan, Japan poised to expand cooperation in semiconductor, 5G, EV
Taiwan and Japan already have complementary cooperation in 5G and semiconductor, and the cooperation will likely expand to electric vehicles (EV) and green energy, according to Taiwan's...
Thursday 27 October 2022
TSMC launches OIP 3DFabric Alliance
TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to help customers achieve fast implementation of silicon and system-level innovations and enable next-generation...
Research Report Database
Summary of Tech Supply Chain News!
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research
Taiwan server industry experiences decline in 2023 revenues and shipments; poised to see growth in 2024, says DIGITIMES Research