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Thursday 23 November 2017
China firm starts equipment move-in at DRAM fab, says report
China-based Fujian Jin Hua Integrated Circuit, which broke ground for a new DRAM fab in July 2017, has started equipment move-in for the facility, according to a report from Taiwan's...
Thursday 12 October 2017
Pure-play foundries boosting presence in China
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
Monday 20 May 2013
TSMC presence in advance process market remains strong
A report has claimed that Samsung Electronics' combined production of chips using advanced 32/28nm process technologies accounted for roughly 50% of the global production of the same...
Tuesday 19 March 2013
Spansion, XMC extend partnership to 32nm
NOR flash memory supplier Spansion has announced that its existing partnership with China-based 12-inch IC foundry XMC now extends to 32nm.
Wednesday 28 November 2012
Intel updates CPU roadmap for 1Q13
Intel is set to upgrade its entry-level desktop Pentium and Celeron product lines in the first quarter of 2013 with the launch of Ivy Bridge-based 22nm Pentium G2130, G2020 and G2020T...
Tuesday 2 October 2012
Globalfoundries 28/32nm foundry capacity hits as high as 80,000 wafers
Globalfoundries' combined capacity for 28/32nm chips has climbed to 60,000-80,000 wafers a month, according to Michael Noonen, the foundry's executive VP for marketing and sales.
Tuesday 2 October 2012
Samsung, STMicro announce foundry deal
Samsung Electronics' foundry business has been selected by STMicroelectronics to provide it with products at the 32/28nm process nodes, according to the Korea-based chipmaker. The...
Tuesday 18 September 2012
AMD 4Q12 revenues to benefit from desktop Trinity APU
AMD is set to announce its latest Trinity APU for the desktop market on October 1 and the new CPU is expected to have chance of boosting the CPU maker's revenue performance in the...
Tuesday 12 June 2012
Nvidia, AMD may miss PC replacement trend brought by Diablo 3
Although the recent release of online PC game Diablo 3 has brought on a strong PC replacement trend in the consumer PC market, Nvidia and AMD may miss a good opportunity as their...
Tuesday 8 May 2012
AMD readies Trinity APU in May and preparing more CPUs for later
AMD is set to launch its latest A series APUs codenamed Trinity in May and will initially only release models for notebooks with models for desktops to wait until August, while the...
Tuesday 21 February 2012
Taiwan market: Acer prices new Cedar Trail netbook below NT$10,000
Notebook vendors including Asustek Computer, Acer, Lenovo, Hewlett-Packard (HP), Samsung Electronics and Toshiba have all already started selling their latest Cedar Trail-based netbooks...
Thursday 2 February 2012
Notebook shipments expected to rise significantly in 2H12
Notebook shipments, benefiting from the recovery of hard drive shortages and launch of Windows 8 in the third quarter, are expected to rise significantly in the second half, compared...
Monday 3 October 2011
Supply of AMD Llano APU unlikely to recover until Trinity arrives
Supply of AMD's Llano APUs, affected by Globalfoundries's lower-than-expected 32nm yield rates, has been significantly limited and is unlikely to recover until the company's upcoming...
Thursday 15 September 2011
IDF 2011: Intel to enter 14nm process in 2014
Intel CPUs will enter 14nm processing by 2014, according to Steven Smith, vice president and head of netbook, tablet PC business speaking at Intel Developer Forum (IDF) in San Fran...
Thursday 18 August 2011
AMD Llano processors suffering from shortage; to be resolved in September
AMD's latest Llano-based processors are currently suffering from shortages due to the weaker-than-expected yield rates of the related 32nm process; however, AMD has already notified...
Friday 4 May 2012
Samsung quad-core application processors
Samsung Electronics has introduced the industry's first quad-core application processor built on the HKMG low-power process technology. With performance capabilities exceeding 1.4GHz based on the ARM Cortex A9 quad-core, the Exynos 4 Quad allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20% lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual. Due to its 32nm HKMG low-power process and power-saving design, the Exynos 4 Quad has two-times the processing capability over the 45nm process based Exynos 4 Dual while consuming 20% less power. To improve power efficiency, Samsung adopted hot-plug functionality to support on-off switching for each core as well as the per-core dynamic voltage and frequency scaling (DVFS), which offers a dramatic reduction in power consumption by adapting different levels of voltage and frequency when changing workloads. Having identical form factor measurement (12X12X1.37mm), the Exynos 4 Quad is pin-to-pin compatible with the 32nm process based Exynos 4 Dual, allowing mobile device designers to immediately adopt the new solution without additional cost, engineering or design efforts. Already in production, the Exynos 4 Quad is scheduled to be adopted first into Samsung's next Galaxy smartphone that will officially be announced in May. Samsung's Exynos 4 Quad is also sampling to other major handset makers.
Thursday 12 January 2012
Toshiba Benand SLC NAND flash
Toshiba has announced the development of Benand, a multi-application single level cell (SLC) NAND flash memory with an embedded error correction code (ECC). Benand's diverse applications include LCD TVs and digital cameras along with robots and other industrial applications. Samples of eight Benand products in two capacities, 4Gb and 8Gb, are now available with mass production slated for March 2012. The ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction. Benand removes the burden of ECC from the host processor while minimizing protocol changes and allowing host processors to support leading-edge process NAND flash memory in a timely manner. Benand embeds an ECC with an error correction of 4 bit per 512 bytes onto Toshiba's 32nm process SLC NAND flash memory. Package and pin configuration compatibility are assured with general SLC NAND flash, allowing easy replacement of existing products. Toshiba plans to expand the Benand lineup to include 24nm process NAND flash memory products after summer 2012. Adding SLC embedded NAND flash memory expands the company's line-ups and offers customers more choices, and will support Toshiba's advances in memory business.