NAND flash prices continue to fall dragging down SSD prices further, which will be driving the adoption of SSDs in enterprise and datacenter applications, according to industry obs...
Macronix International has been engaged in 3D NAND technology R&D, and plans to offer 48- and 96-layer processes to deliver 128Gb and 256Gb products, according to company president...
NAND flash contract prices will keep falling in the second half of 2018 due to the market oversupply and disappointing demand, according to DRAMeXchange.
Downward movement of prices for solid state drives (SSDs) and growing requirement for higher storage capacities have prompted notebook vendors such as HP and Dell to boost the adoption...
Micron Technology has announced general availability of the 128GB and 256GB density of edge storage microSD card solutions and collaboration with several leading video surveillance...
SSD suppliers have recently cut prices to promote their 64- and 72-layer 3D devices, which is expected to accelerate the adoption of SSDs in notebooks, according to DRAMeXchange.
Micron Technology has announced three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new...
SK Hynix has announced the company completed recently the development of enterprise SATA SSDs built using its 72-Layer 512Gb (Gigabits) 3D NAND flash chips.
Toshiba Memory has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of the...
Micron Technology has announced a full portfolio of edge storage solutions for video surveillance that will enable new deployment models and reduce total cost of ownership for both...
NAND flash vendors have increased chip prices citing strong demand for new smartphones particularly the iPhone 7 featuring up to 256GB of storage, according to industry sources. Prices...
Samsung Electronics has announced it is now mass producing 256GB embedded memory based on the Universal Flash Storage (UFS) 2.0 standard, for next-generation high-end mobile devices...
Samsung Electronics has begun mass producing 256Gb, three-dimensional (3D) vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in...
SanDisk has announced its 256Gb 3-bit-per-cell (X3) 48-layer 3D NAND chip and the start of 3D NAND pilot line operations in Yokkaichi, Japan in conjunction with its partner, Toshib...
