Intel plans to launch three new 7 series chipsets – Z77, Z75 and H77, supporting its upcoming 22nm Ivy Bridge-based CPUs and the existing 32nm Sandy Bridge-based CPUs, in March...
Intel has announced a breakthrough in the evolution of the transistor. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional...
Motherboard prices, affected by upstream component shortages caused by the Japan earthquake, are set to rise for the second time this year after mid-April, according to sources from...
Intel reportedly has completed the design of its 22nm Ivy Bridge processors and will showcase the new CPUs at Computex Taipei 2011 in June, according to a Chinese-language Commercial...
By the end of 2011, there may be only three remaining sources for high-volume and leading-edge semiconductor foundry manufacturing: Taiwan Semiconductor Manufacturing Company (TSMC),...
FPGA startup Achronix Semiconductor's recent announcement that Intel will make 22nm chips for it has sparked speculation that the chip giant is looking to share the higher end segment...
Globalfoundries has announced the addition of a new technology offering based on its 28nm high-k metal gate (HKMG) technology, and revealed for the first time its manufacturing timeline...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it will skip the 22nm manufacturing process node and move directly to a 20nm technology, and TSMC is expected to...
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to enter trial production on its 22nm high performance process node in the third quarter of 2012, and then move to the...
Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...
IMEC, a Belgium-based research center in nanoelectronics and nanotechnology, and Taiwan Semiconductor Manufacturing Company (TSMC) on October 6 jointly announced the extension of their...
Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in 2012 despite a conservative outlook prevailing across most...
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory...
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
