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NEWS TAGGED 22NM
Thursday 2 September 2010
Globalfoundries adds new 28nm technology offering, unveils 22/20nm roadmap
Globalfoundries has announced the addition of a new technology offering based on its 28nm high-k metal gate (HKMG) technology, and revealed for the first time its manufacturing timeline...
Wednesday 14 April 2010
TSMC to skip 22nm, moving directly to 20nm
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it will skip the 22nm manufacturing process node and move directly to a 20nm technology, and TSMC is expected...
Thursday 25 February 2010
TSMC to begin trial production on 22nm process in 3Q12, says R&D head
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to enter trial production on its 22nm high performance process node in the third quarter of 2012, and then move to the...
Monday 12 October 2009
ASML upbeat on micro-lithography growth
Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...
Wednesday 7 October 2009
IMEC, TSMC team up for miniaturized designs
IMEC, a Belgium-based research center in nanoelectronics and nanotechnology, and Taiwan Semiconductor Manufacturing Company (TSMC) on October 6 jointly announced the extension of...
Friday 2 October 2009
TSMC maintains 18-inch wafer tape-out in 2012
Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in 2012 despite a conservative outlook prevailing across most...
Wednesday 30 September 2009
UMC focusing R&D on 28nm, 22nm processes
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
Wednesday 23 September 2009
IDF San Francisco: Moore's Law marches on at Intel
Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory...
Tuesday 15 September 2009
KLA-Tencor extends reticle inspection systems to 2Xnm
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
Wednesday 2 September 2009
KLA-Tencor keeping up R&D spending despite difficult times
R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...
Tuesday 14 July 2009
Globalfoundries calls for renewed focus on 300mm
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Monday 6 July 2009
TSMC joins CEA-Leti program on multiple e-beam lithography
Taiwan Semiconductor Manufacturing Company (TSMC) has announced it will join a three-year program led by the CEA-Leti research institute on electron-beam (e-beam) maskless lithography...
Thursday 4 June 2009
TSMC to base European R&D at IMEC
IMEC, an Belgium-based nanoelectronics research center in nanoelectronics and nanotechnology, has signed an expanded research agreement with Taiwan Semiconductor Manufacturing Company...
Monday 18 May 2009
TSMC sees delay in e-beam equipment delivery
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...
Thursday 23 April 2009
TSMC beefs up R&D, moving to 22nm by 2011
Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...