CONNECT WITH US
NEWS TAGGED 16NM
Thursday 18 April 2013
TSMC 16nm FinFET to enter mass production within one year after 20nm ramp-up, says Chang
TSMC's 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting...
Tuesday 2 April 2013
TSMC tapes out first 16nm FinFET test chips
ARM and Taiwan Semiconductor Manufacturing Company (TSMC) have jointly announced the first tape-out of a Cortex-A57 processor on FinFET process technology.
Tuesday 26 March 2013
Imagination, TSMC extend collaboration to FinFET and 3D ICs
Imagination Technologies and contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) have announced the next phase of their technology collaboration.
Monday 26 November 2012
NAND flash makers gearing up for process transition
NAND flash chipmakers are gearing up for transition to a newer 16nm process in 2013, according to industry sources. Nonetheless, the schedule for mass production on the node will...
Thursday 8 November 2012
TSMC 16nm FinFET rollout to come earlier than expected, says Digitimes Research analyst
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to ramp up 20nm production ahead of schedule, and also put its 16nm FinFET process into production far earlier than expected,...
Thursday 21 October 2010
EUV to get ready for high-volume production in 2014, says IMEC chief
Extreme ultraviolet (EUV) lithography is likely to reach mass production in 2014 at the earliest, according to Luc Van den hove, president and CEO of Belgian researcher IMEC. But...
Thursday 15 April 2010
TSMC to develop below 14nm process, says chairman
Taiwan Semiconductor Manufacturing Company (TSMC) will be part of the industry's drive in the development of wafer manufacturing processes below 14nm, according to company chairman...
Wednesday 16 December 2009
Taiwan government lab seeking alliance with local semiconductor makers for 15nm development
The National Nano Device Laboratories (NDL) in Taiwan plans to forge an R&D alliance of the country's major semiconductor makers focusing on the development of 15nm chip components,...
Monday 15 June 2009
Toshiba announces high-k/Ge gate stack technology for 16nm and beyond
Toshiba has announced a significant advance in the development of a gate stack and interlayer with high carrier mobility that can be applied to advanced metal-insulator-semiconductor...