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NEWS TAGGED 12-INCH WAFER
Monday 7 December 2020
PSMC in talks for new orders from panel vendor
Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) is in talks to rent new 12-inch fab equipment from a panel customer who intends to secure sufficient production capacity...
Wednesday 25 November 2020
Taiwan Mask optimistic about 2021
Photomask supplier Taiwan Mask (TMC) has expressed optimism about its operations in 2021, citing robust demand from 8-inch and 12-inch foundries for mature-node manufacturing.
Monday 23 November 2020
TSMC reportedly plans capacity expansion at Nanjing fab
TSMC has decided to build new facilities at its 12-inch fab in Nanjing to satisfy growing demand from the foundry's local customers in China, according to a report by Taiwan's Central...
Wednesday 11 November 2020
IC materials distributors optimistic about 4Q20
Thanks to high capacity utilization at foundry and backend houses, IC materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all optimistic...
Tuesday 6 October 2020
Micron eyeing new patent infringement lawsuit against China memory firm
Micron Technology has expressed its concerns to DRAM module manufacturers that chips developed by China-based ChangXin Memory Technologies (CXMT) may violate its patents, according...
Wednesday 30 September 2020
China memory chipmakers could be next US trade ban target
With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...
Monday 28 September 2020
Driver IC, MOSFET prices to go up amid tight foundry capacity
Taiwan's vendors of LCD driver ICs and MOSFET chips are mulling raising their quotes to reflect increased costs resulting from tight capacity at 8-inch or even 12-inch wafer fabs,...
Thursday 24 September 2020
ASE set to volume produce chip-last FOCoS process in 2021
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
Tuesday 15 September 2020
CIS packager Xintec posts record revenues for August
CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...
Friday 14 August 2020
Xintec sees 12-inch wafer probing as new growth driver
Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...
Wednesday 5 August 2020
GlobalWafers posts 18% profit surge in 2Q20
Silicon wafer manufacturer GlobalWafers has reported net profits grew 18% sequentially to NT$3.4 billion (US$115.5 million) in the second quarter, with net profit margin hitting a...
Monday 3 August 2020
TSMC develops dry-clean technique for EUV mask
TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.
Thursday 23 July 2020
Micron gearing up for handset market boom in 2H21
Micron Technology remains optimistic about its operations in the fourth quarter of fiscal 2020, thanks to continued strong demand for data center applications, and the company's efforts...
Wednesday 15 July 2020
Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...
Thursday 9 July 2020
Winbond enhances high-density NOR flash offering
Winbond Electronics has been stepping up its deployment in the high-density NOR flash field, gearing up for a boom in demand for 5G related applications, according to company president...