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NEWS TAGGED 0.13-MICRON
Friday 9 February 2018
Globalfoundries 22FDX process to attract more orders, says company executive
After securing orders from STMicroelectronics, Globalfoundries' 22nm FD-SOI (22FDX) process is being evaluated by hundreds of potential customers looking to use a more advanced fully-depleted...
Monday 27 July 2015
Toshiba develops 2 new process technologies for MCUs, wireless ICs
Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog...
Tuesday 24 March 2015
Hua Hong, eMemory partner to develop MCUs for IoT
Hua Hong Semiconductor and eMemory Technology have jointly announced they will further strengthen their strategic partnership and work together in the field of microcontrollers (MCU),...
Friday 18 October 2013
SMIC launches 0.13-micron LL eFlash process
Semiconductor Manufacturing International (SMIC) has moved its 0.13-micron low-leakage (LL) embedded flash (eFlash) process to volume production, according to the China-based IC foundry...
Wednesday 14 March 2012
Silterra launches 130nm CMOS logic aluminum backend technology
Malaysia-based wafer foundry Silterra has announced the release of 130nm CMOS logic technology with aluminum backend interconnection, CL130AL, for mainstream and high-volume consumer...
Friday 28 January 2011
Driver IC production at 8-inch, 0.13-micron process sees tight capacity
LCD driver IC production which is mostly undertaken by 8-inch, 0.13-micron high-voltage process at foundries at present is experiencing tight capacity, but the situation is unlikely...
Thursday 30 September 2010
TSMC approved to produce on 0.13-micron in China
An application by Taiwan Semiconductor Manufacturing Company (TSMC) to fabricate on 0.13-micron technology at its Songjiang 8-inch fab in Shanghai was approved by the Investment Commission...
Monday 27 September 2010
Grace moves 0.13-micron embedded flash process to volume production
Grace Semiconductor Manufacturing has kicked off volume production of its 0.13-micron embedded flash solution, according to the Shanghai-based pure-play foundry.
Wednesday 7 April 2010
Grace enhances design services to customized embedded flash macros
China-based foundry Grace Semiconductor Manufacturing has launched an IP portfolio developed to assist customers in complementing their own IC design. The IP blocks offer various...
Tuesday 30 March 2010
Taiwan Mask denies rumor of acquisition by TSMC
Photomask supplier Taiwan Mask Corporation (TMC) has denied local media reports indicating that it will be acquired by Taiwan Semiconductor Manufacturing Company (TSMC) for NT$15...
Tuesday 30 March 2010
TSMC announces bid for approval to take SMIC stake
Taiwan Semiconductor Manufacturing Company (TSMC) on March 29 announced it has formally filed an application with the Taiwan government to take up a stake in China-based Semiconductor...
Friday 5 March 2010
Macronix able to sustain revenue target for 1Q10, says president
Mask ROM and NOR flash memory maker Macronix International Company (MXIC) will be able to sustain its revenues target of NT$6.1-6.3 billion (US$188-197 million) for the first quarter...
Wednesday 3 March 2010
BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
Thursday 17 September 2009
GSMC striving to become top-five foundry chipmaker, says paper
Shanghai-based foundry service provider Grace Semiconductor Manufacturing Corporation (GSMC) will see its first profitable quarter in the third quarter of 2009, and aims to become...
Monday 31 August 2009
Photomask supplier PSMC seeing growing demand from UMC
Taiwan-based photomask supplier Photronics Semiconductor Mask Corporation (PSMC) has seen increased mask orders for mature processes from United Microelectronics Corporation (UMC),...